DOI QR코드

DOI QR Code

낮은 순방향 전압 강하를 갖는 4H-SiC Trench-type Accumulation Super Barrier Rectifier(TASBR)

4H-SiC Trench-type Accumulation Super Barrier Rectifier(TASBR) for Low Forward Voltage drop

  • Bae, Dong-woo (Dept. of Electronic Engineering, Sogang University) ;
  • kim, Kwang-soo (Dept. of Electronic Engineering, Sogang University)
  • 투고 : 2016.12.29
  • 심사 : 2017.03.29
  • 발행 : 2017.03.31

초록

실리콘카바이드 소자는 넓은 밴드갭을 갖는 물질로서 많은 주목을 받아왔다. 특히 4H-SiC 쇼트키 배리어 다이오드는 빠른 스위칭 속도와 낮은 순방향 전압강하의 특성으로 인해 널리 사용되고 있다. 그러나 쇼트키 배리어 다이오드의 낮은 신뢰성으로 인한 문제로 대안인 Super Barrier Rectifier(SBR)가 연구되었다. 본 논문은 4H-SiC trench-type accumulation super barrier rectifier(TASBR)를 분석하고 제안한다. 2D 시뮬레이션을 통해 본 구조는 심각한 역방향 저지전압의 감소와 누설전류의 증가가 없는 동시에 순방향 전압 강하는 21.06% 향상됨을 확인 할 수 있었다. 이러한 새로운 정류기 구조를 이용하면 전력손실이 적은 애플리케이션을 기대할 수 있다.

SiC devices have drawn much attentions for its wide band gap material properties. Especially 4H-SiC Schottky barrier diode is widely used for its rapid switching speed and low forward voltage drop. However, the low reliability of Schottky barrier diode has many problems that Super Barrier Rectifier(SBR) was researched for alternative. makes 4H-SiC trench-type accumulation super barrier rectifier(TASBR) is analyzed and proposed in this paper. We could verified that forward voltage drop was improved 21.06% without severe degradation of reverse breakdown voltage and leakage current based on the results from 2-D numerical simulations. With this novel rectifier structure, we can expect application with less power loss.

키워드

참고문헌

  1. G. H. Song and K. K. Kim, "SiC/SiO2 Interface Characteristics in N-based 4H-SiC MOS Capacitor Fabricated with PECVD and NO Annealing Processes," j.inst.Korean.electr.electron.eng, vol. 18, no.4, pp. 447-455, Dec. 2014. DOI:10.7471/ikeee.2014.18.4.447
  2. B. J. Baliga, "Fundamentals of Power Semiconductor Devices," NY, USA: Springer , 2010, pp. 91-166.
  3. Chin-Fang Huang, Hua-Chih Hsu, Kuan-Wei Chu, Li-Heng Lee, Ming-Jinn Tsai, Kung-Yen and Feng Zhao "Counter-Doped JTE, an Edge Termination for HV SiC Devices With Increased Tolerance to the Surface Charge" IEEE Electron Device Lett., vol. 62, no. 2, pp. 354-358, Feb. 2015. DOI: 10.1109/TED.2014.2361535
  4. B. S. Kim and K. K. Kim, "A 4H-SiC Trench MOS Barrier Schottky (TMBS) Rectifier using the trapezoid mesa and the upper half of sidewall," j.inst.Korean.electr.electron.eng, vol. 17, no.4, pp. 428-433, Dec. 2013. DOI : 10.7471/ikeee.2013.17.4.428
  5. V. Rodov, A. L. Ankoudinov, Taufic, "Super Barrier Rectifier - A New Generation of Power Diode," Applied Power Electronics Conference, APEC 2007 - Twenty Second Annual IEEE, vol., no., pp.1053-1056, Feb. 25 2007 March 1 2007.DOI: 10.1109/TIA.2007.912752