한국전기전자재료학회논문지 (Journal of the Korean Institute of Electrical and Electronic Material Engineers)

  • 제30권4호
  • /
  • Pages.235-240
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  • 2017
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  • 1226-7945(pISSN)
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  • 2288-3258(eISSN)
한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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입자 사이즈에 따른 Cu 필름의 에어로졸 성막 거동에 대한 연구

Study on Aerosol Deposition Behavior of Cu Films According to Particle Size

  • 이동원 (한국산업기술시험원 재료기술센터) ;
  • 오종민 (광운대학교 전자재료공학과)
  • Lee, Dong-Won (Material Technology Center, Korea Testing Laboratory) ;
  • Oh, Jong-Min (Department of Electronic Materials Engineering, Kwangwoon University)
  • 투고 : 2017.02.13
  • 심사 : 2017.02.25
  • 발행 : 2017.04.01
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초록

The effect of particle sizes on the aerosol deposition (AD) of Cu films is investigated in order to understand the deposition behaviors of metal powder during the AD process. The Cu coatings fabricated by using $2{\mu}m$ Cu powders had a dense microstructure, a high deposition rate ($1.6{\pm}0.2{\mu}m/min$), and low resistance ($9.42{\pm}0.4{\mu}{\Omega}{\cdot}cm$) compared to that from using Cu powder with a particle size greater than $5{\mu}m$. Also, from estimating the internal micro-strain of Cu films, the Cu coatings fabricated by using $2{\mu}m$ Cu particles exhibited a high micro-strain value of $3.307{\times}10^{-3}$. On the other hand, the strain of Cu coatings fabricated with $5{\mu}m$ particles was decreased to $2.76{\times}10^{-3}$. These results seem to show that the impacted Cu particles are compressed and flattened by shock waves, and that their bonding is associated with the high internal micro-strain caused by plastic deformation.

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참고문헌

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