DOI QR코드

DOI QR Code

An Accurate Modeling Approach to Compute Noise Transfer Gain in Complex Low Power Plane Geometries of Power Converters

  • Received : 2016.09.01
  • Accepted : 2017.01.17
  • Published : 2017.03.20

Abstract

An approach based on a 2D lumped model is presented to quantify the voltage transfer gain (VTG) in power converter low power planes. The advantage of the modeling approach is the ease with which typical noise reduction devices such as decoupling capacitors or ferrite beads can be integrated into the model. This feature is enforced by a new modular approach based on effective matrix partitioning, which is presented in the paper. This partitioning is used to decouple power plane equations from external device impedance, which avoids the need for rewriting of a whole set of equation at every change. The model is quickly solved in the frequency domain, which is well suited for an automated layout optimization algorithm. Using frequency domain modeling also allows the integration of frequency-dependent devices such inductors and capacitors, which are required for realistic computation results. In order to check the precision of the modeling approach, VTGs for several layout configurations are computed and compared with experimental measurements based on scattering parameters.

Keywords

References

  1. K. Raggl, T. Nussbaumer and J. Kolar, "Guideline for a simplified differential-mode EMI filter design," IEEE Trans. Ind. Electron., Vol. 57, No. 3, pp. 1031-1040, March 2010. https://doi.org/10.1109/TIE.2009.2028293
  2. H. Akagi and T. Shimizu, "Attenuation of conducted EMI emissions from an inverter-driven motor," IEEE Trans. Power Electron., Vol. 23, No. 1, pp. 282-290, Jan. 2008. https://doi.org/10.1109/TPEL.2007.911878
  3. A. J. McDowell and T. H. Hubing, "A compact implementation of parasitic inductance cancellation for shunt capacitor filters on multilayer PCBs," IEEE Trans. Electromagn. Compat., Vol. 57, No. 2, pp. 257-263, Apr. 2015. https://doi.org/10.1109/TEMC.2014.2364990
  4. D. Shin , S. Kim, G. Jeong, J. Park, J. Park, K. J. Han, and J. Kim, "Analysis and design guide of active EMI filter in a compact package for reduction of common-mode conducted emissions," IEEE Trans. Electromagn. Compat., Vol. 57, No. 4, pp. 660-671, 2015. https://doi.org/10.1109/TEMC.2015.2401001
  5. J. Biela, A. Wirthmueller, R. Waespe, M. L. Heldwein, K. Raggl and J. W. Kolar, "Passive and active hybrid integrated EMI filters," IEEE Trans. Power Electron., Vol. 24, No. 5, pp. 1340-1349, May 2009. https://doi.org/10.1109/TPEL.2009.2012404
  6. Y. Maillet, R. Lai, S. Wang, F. Wang, R. Burgos and D. Boroyevich, "High-density EMI filter design for DC-fed motor drives," IEEE Trans. Power Electron., Vol. 25, No. 5, pp. 1163-1172, May 2010. https://doi.org/10.1109/TPEL.2009.2039004
  7. J. Espina, J. Balcells, A. Arias, and C. Ortega, "Common mode EMI model for a direct matrix converter," IEEE Trans. Ind. Electron., Vol. 58, No. 11, pp. 5049-5056, Nov. 2011. https://doi.org/10.1109/TIE.2011.2158774
  8. E. Rondon-Pinilla, F. Morel, C. Vollaire, and J. L. Schanen, "Modeling of a buck converter with a SiC JFET to predict EMC conducted emissions," IEEE Trans. Power Electron., Vol. 29, No. 5, pp. 2246-2260, May 2014. https://doi.org/10.1109/TPEL.2013.2295053
  9. M. Ferber, C. Vollaire, L. Krahenbuhl, J. L. Coulomb and J. A. Vasconcelos, "Conducted EMI of DC-DC converters with parametric uncertainties," IEEE Trans. Electromagn. Compat., Vol. 55, No. 4, pp. 699-706, Aug. 2013. https://doi.org/10.1109/TEMC.2012.2235443
  10. L. Zhai, B. Xu, N. Bondarenko, G. Li, T. Makharashvili, D. Loken, P. Berger, T. Van Doren, and D. Beetner, "A measurement - Based model of the electromagnetic emissions from a power inverter," IEEE Trans. Power Electron., Vol. 30, No. 10, pp. 5522-5531, Oct. 2015. https://doi.org/10.1109/TPEL.2014.2384030
  11. V. Ardon, J. Aime, O. Chadebec, E. Clavel, J. M. Guichon and E. Vialardi, "EMC modeling of an industrial variable speed drive with an adapted PEEC method," IEEE Trans. Magn., Vol. 46, No. 8, pp.2892-2898, 2010. https://doi.org/10.1109/TMAG.2010.2043420
  12. P. Musznicki, M. Turzynski, and P. J. Chrzan, "Accurate modeling of quasi-resonant inverter fed IM drive," in Proc. IECON 2013 , pp. 376-381, Nov. 2013.
  13. R. Mrad, F. Morel, G. Pillonnet, C. Vollaire, P. Lombard, and A. Nagari, "N-conductor passive circuit modeling for power converter current prediction and EMI aspect," IEEE Trans. Electromagn. Compat., Vol. 55, No. 6, pp. 1169-1177, 2013. https://doi.org/10.1109/TEMC.2013.2265048
  14. H. Wu, J. Zhang, and Y. Xing, "A family of multi-port buck-boost converters based on DC-link-inductors (DLIs)," IEEE Trans. Power Electron., Vol. 30, No. 2, pp. 735-746, Feb. 2015. https://doi.org/10.1109/TPEL.2014.2307883
  15. M. Hagiwara and H. Akagi, "Control and experiment of pulse width modulated modular multilevel converters," IEEE Trans. Power Electron., Vol. 24, No. 7, pp. 1737-1746, Jul. 2009. https://doi.org/10.1109/TPEL.2009.2014236
  16. G. Lei, R. W. Techentin, and B. K. Gilbert, "High-frequency characterization of power/ground-plane structures," IEEE Trans. Microw. Theory and Tech., Vol. 47, No. 5, pp. 562-569, May 1999. https://doi.org/10.1109/22.763156
  17. M. Hampe and S. Dickmann, "Damping of cavity-mode resonances in PCB power-bus structures using discrete capacitors," IEEE Trans. Electromagn. Compat., Vol. 47, No. 4, pp. 880-888, Nov. 2005. https://doi.org/10.1109/TEMC.2005.857355
  18. J. Fan, J. L. Drewniak, J. L. Knighten, N. W. Smith, A. Orlandi, T. P. Van Doren, T. H. Hubing and R. E. DuBroff, "Quantifying SMT decoupling capacitor placement in DC power-bus design for multilayer PCBs," IEEE Trans. Electromagn. Compat., Vol. 43, No. 4, pp. 588-599, Nov. 2001. https://doi.org/10.1109/15.974639
  19. Y. J. Kim, H. S. Yoon, S. Lee, G. Moon, J. Kim, and J. K. Wee, "An efficient path-based equivalent circuit model for design, synthesis, and optimization of power distribution networks in multilayer printed circuit boards," IEEE Trans. Adv. Packag., Vol. 27, No. 1, pp. 97-106, 2004. https://doi.org/10.1109/TADVP.2004.825481
  20. M. Hampe, V. A. Palanisamy, and S. Dickmann, "Single summation expression for the impedance of rectangular PCB power-bus structures loaded with multiple lumped elements," IEEE Trans. Electromagn. Compat., Vol. 49, No. 1, pp. 58-67, Feb. 2007. https://doi.org/10.1109/TEMC.2006.888188
  21. M. Stumpf and M. Leone, "Efficient 2-D integral equation approach for the analysis of power bus structures with arbitrary shape," IEEE Trans. Electromagn. Compat., Vol. 51, No. 1, pp. 38-45, Feb. 2009. https://doi.org/10.1109/TEMC.2008.2009223
  22. M. Stumpf, "The time-domain contour integral method - An approach to the analysis of double - plane circuits," IEEE Trans. Electromagn. Compat., Vol. 56, No. 2, pp. 367-374, Apr. 2014. https://doi.org/10.1109/TEMC.2013.2280297
  23. L. D. Smith, R. Andersonm and T. Roy, "Power plane SPICE models and simulated performance for materials and geometries," IEEE Trans. Adv. Packag., Vol. 24, No. 3, pp. 277-287, Aug. 2001. https://doi.org/10.1109/6040.938294
  24. C. Guo and T. H. Hubing, "Circuit models for power bus structures on printed circuit boards using a hybrid FEM-SPICE method," IEEE Trans. Adv. Packag., Vol. 29, No. 3, pp. 441-447, Aug. 2006. https://doi.org/10.1109/TADVP.2006.875089
  25. C. Bednarz, A. Mantzke, and M. Leone, "Efficient FEM-based modal circuit representation of arbitrarily shaped plate pairs," IEEE Trans. Electromagn. Compat., Vol. 56, No. 4, pp. 990-993, 2014. https://doi.org/10.1109/TEMC.2013.2294542
  26. H. M. Lee, S. Gao, E. X. Liu, G. S. Samudra and E. P. Li, "Two dimensional discontinuous Galerkin time-domain method for modeling of arbitrarily shaped power-ground planes,"IEEE Trans. Electromagn. Compat., Vol. 57, No. 6, pp. 1744-1747, Dec. 2015. https://doi.org/10.1109/TEMC.2015.2443019
  27. R. Sourajeet, and A. Dounavis, "Macromodeling of multilayered power distribution networks based on multiconductor transmission line approach," IEEE Trans. Comp. Packag. Manufact. Tech., Vol. 3, No. 6, pp. 1047-1056, 2013. https://doi.org/10.1109/TCPMT.2013.2245377
  28. J. -H. Kim and M. Swaminathan, "Modeling of irregular shaped power distribution planes using transmission matrix method," IEEE Trans. Adv. Packag., Vol. 24, No. 3, pp. 334-346, Aug. 2001. https://doi.org/10.1109/6040.938301
  29. L. Sevgi, "Electromagnetic modeling and simulation: challenges in validation, verification, and calibration," IEEE Trans. Electromagn. Compat., Vol. 56, No. 4, pp. 750-758, Aug. 2014. https://doi.org/10.1109/TEMC.2013.2280135
  30. D. M. Pozar, Microwave Engineering, John Wiley & Sons, 2009.
  31. A. Ales, J. L. Schanen, D. Moussaoui and J. Roudet, "Impedances identification of DC/DC converters for network EMC analysis," IEEE Trans. Power Electron., Vol. 29, No. 12, pp. 6445-6457, Dec. 2014. https://doi.org/10.1109/TPEL.2014.2302851
  32. D. Baudry, C. Arcambal, A. Louis, B. Mazari, and P. Eudeline, "Applications of the near-field techniques in EMC investigations," IEEE Trans. Electromagn. Compat., Vol. 49, No. 3, pp. 485-493, 2007. https://doi.org/10.1109/TEMC.2007.902194
  33. H. Shall, R. Zouheir Riah, and M. Kadi, "A 3-D near-field modeling approach for electromagnetic interference prediction," IEEE Trans. Electromagn. Compat., Vol. 56, No. 1, pp. 102-112, 2014. https://doi.org/10.1109/TEMC.2013.2274576
  34. H. W. Ott, Electromagnetic Compatibility Engineering, John Wiley & Sons, 2011.
  35. C. Rostamzadeh and B. Archambeault, "Numerical and experimental investigation of PCB ground-fill on radiated EMI," in Proc. IEEE ISEC, 2006.