• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.05a
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• pp.788-791
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• 2010

We design 64-bit ROM IP for RFID tag chips using printed CMOS non-volatile memory IP design technology for a printed CMOS process. The proposed 64-bit ROM circuit is using ETRI's $0.8{\mu}m$ CMOS porocess, and is expected to reduce process complexity and cost of RFID tag chips compared to that using a conventional silicon fabrication based on a complex lithography process because the poly layer in a gate terminal is using printing technology of imprint process. And a BL precharge circuit and a BL sense amplifier is not required for the designed cell circuit since it is composed of a transmission gate instead of an NMOS transistor of the conventional ROM circuit. Therefore an output datum is only driven by a DOUT buffer circuit. The Operation current and layout area of the designed ROM of 64 bits with an array of 8 rows and 8 columns using $0.8{\mu}m$ ROM process is $9.86{\mu}A$ and $379.6{\times}418.7{\mu}m^2$.

• Journal of the Korea Society of Computer and Information
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• v.21 no.3
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• pp.1-8
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• 2016

The printed circuit board (PCB) can be used only 2 layers of front and back. Therefore, the wiring line segments are located in 2 layers without crossing each other. In this case, the line segment can be appear in both layers and this line segment is to resolve the crossing problem go through the via. The via minimization problem (VMP) has minimum number of via in layout design problem. The VMP is classified by NP-complete because of the polynomial time algorithm to solve the optimal solution has been unknown yet. This paper suggests polynomial time algorithm that can be solve the optimal solution of VMP. This algorithm transforms n-line segments into vertices, and p-crossing into edges of a graph. Then this graph is partitioned into 3-coloring sets of each vertex in each set independent each other. For 3-coloring sets $C_i$, (i=1,2,3), the $C_1$ is assigned to front F, $C_2$ is back B, and $C_3$ is B-F and connected with via. For the various experimental data, though this algorithm can be require O(np) polynomial time, we obtain the optimal solution for all of data.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.1195-1196
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• 2008

It is difficult to solve PCB(Printed Circuit Board) Noise problem. Because Electronic circuit system operates very high frequency. Resonance analysis of PCB layout by PI(Power Integrity) Simulation method visualizes distribution of Switching noise between VDD and GND. By using de-cap, we reduce impedance and solve the EMI problems.

• Journal of IKEEE
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• v.17 no.3
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• pp.324-331
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• 2013

In this paper, we implemented memristor emulator circuit on Printed Circuit Board (PCB) and observed the inherent pinched hysteresis characteristic of memristors by measuring the emulator circuit on PCB. The memristor emulator circuit implemented on PCB is composed of simple discrete devices not using any complicated circuit blocks thus we can integrate the memristor emulator circuits in very small layout area on Silicon substrate. The programmable gain amplifier is designed using the proposed memristor emulator circuit and verified that the amplifier's voltage gain can be controlled by programming memristance of the emulator circuit by circuit simulation. Threshold switching is also realized in the proposed emulator circuit thus memristance can remain unchanged when the input voltage applied to the emulator circuit is lower than VREF. The memristor emulator circuit and the programmable gain amplifier using the proposed circuit can be useful in teaching the device operation, functions, characteristics, and applications of memristors to students when thet cannot access to device and fabrication technologies of real memristors.

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.577-579
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• 2004

Digital hearing aids enclose $6{\sim}8$ tiny components. Those electromechanical components are individually wired by soldering which is a manual labor and sometimes causes components' damage by heating. This paper suggests a PCB design for overcome these problems. Several PCBs are designed and manufactured and circuited to produce ITE(In The Ear) type hearing aids which are inserted in the ear canal. The most optimal size of the PCB design for the ITE hearing aid is presented in this paper.

• Journal of Power Electronics
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• v.17 no.2
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• pp.411-421
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• 2017

An approach based on a 2D lumped model is presented to quantify the voltage transfer gain (VTG) in power converter low power planes. The advantage of the modeling approach is the ease with which typical noise reduction devices such as decoupling capacitors or ferrite beads can be integrated into the model. This feature is enforced by a new modular approach based on effective matrix partitioning, which is presented in the paper. This partitioning is used to decouple power plane equations from external device impedance, which avoids the need for rewriting of a whole set of equation at every change. The model is quickly solved in the frequency domain, which is well suited for an automated layout optimization algorithm. Using frequency domain modeling also allows the integration of frequency-dependent devices such inductors and capacitors, which are required for realistic computation results. In order to check the precision of the modeling approach, VTGs for several layout configurations are computed and compared with experimental measurements based on scattering parameters.

• Journal of Power Electronics
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• v.9 no.2
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• pp.308-319
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• 2009

An increasing number of power electronic applications require high power density. Therefore, the switching frequency and switching speed have to be raised considerably. However, the very fast switching transients induce a strong voltage and current ringing. In this work, a novel damping concept is introduced where the parasitic wiring inductances are advantageously magnetically coupled with a damping layer for attenuating these unwanted oscillations. The proposed damping layer can be implemented using standard materials and printed circuit board manufacturing processes. The system behavior is analyzed in detail and design guidelines for a damping layer with optimized RC termination network are given. The effectiveness of the introduced layer is determined by layout parasitics which are calculated by application of the Partial Element Equivalent Circuit (PEEC) simulation method. Finally, simulations and measurements on a laboratory prototype demonstrate the good performance of the proposed damping approach.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.2
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• pp.639-643
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• 2018

As electronic systems become smaller and more portable, the need for power conversion continues to increase. In addition, system stability must be ensured from switching noise due to power conversion efficiency and power conversion system miniaturization. Therefore, countermeasures to reduce switching noise during power conversion are essential. In this paper, a DC/DC buck converter circuit is constructed, and the characteristics of switching noise generated when changing the parts layout in a four-layer printed circuit board (PCB) structure with a reference plane are compared and analyzed. In addition, switching noise characteristics were compared and analyzed through simulations when the parts layout was different in a two-layer PCB structure from which the reference planes were removed. As a result, it was confirmed that the radiated emissions characteristic is reduced by 12dB and the conducted emissions characteristic decreased by 7dB to 8dB, according to the current return path in the four-layer PCB structure. Thus, it was confirmed that the noise characteristics can be improved according to the configuration of the current return path when the power conversion circuit is designed.

• Journal of Sensor Science and Technology
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• v.17 no.1
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• pp.15-22
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• 2008

When designing image sensors including a CMOS vision chip for edge detection, resolution is a significant factor to evaluate the performance. It is hard to improve the resolution of a bio-inspired CMOS vision using a resistive network because the vision chip contains many circuits such as a resistive network and several signal processing circuits as well as photocircuits of general image sensors such as CMOS image sensor (CIS). Low resolution restricts the use of the application systems. In this paper, we improve the resolution through layout and circuit optimization. Furthermore, we have designed a printed circuit board using FPGA which controls the vision chip. The vision chip for edge detection has been designed and fabricated by using $0.35{\mu}m$ double-poly four-metal CMOS technology, and its output characteristics have been investigated.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.75-79
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• 2013

A power distribution network (PDN) is a network that provides connection between the voltage source supply and the power/ground terminals of a microprocessor chip. It consists of a voltage regulator module, a printed circuit board, a package substrate, a microprocessor chip as well as decoupling capacitors. For power integrity analysis, the board and package layouts have to be transformed into an electrical network of resistor, inductor and capacitor components which may be expressed using the S-parameters models. This modeling process generally takes from several hours up to a few days for a complete board or package layout. When the board and package layouts change, they need to be re-extracted and the S-parameters models also need to be re-generated for power integrity assessment. This not only consumes a lot of resources such as time and manpower, the task of PDN modeling is also tedious and mundane. In this paper, a block-based PDN modeling is proposed. Here, the board or package layout is partitioned into sub-blocks and each of them is modeled independently. In the event of a change in power rails routing, only the affected sub-blocks will be reextracted and re-modeled. Simulation results show that the proposed block-based PDN modeling not only can save at least 75% of processing time but it can, at the same time, keep the modeling accuracy on par with the traditional PDN modeling methodology.