References
- J. G. Lee, J. H. Yu, H. J. Kim, and T. S. Jang, J. Kor. Mag. Soc., 22, 58 (2012). [DOI: https://doi.org/10.4283/JKMS.2012.22.2.058]
- B. M. Ma, IEEE Trans. Magn., 22, 916 (1986). [DOI: https://doi.org/10.1109/TMAG.1986.1064527]
- S. Namkung, M. W. Lee, D. R. Dhakal, T. H. Lim, T. H. Kim, S. R. Lee, and T. S. Jang, J. Kor. Powd. Met. Inst., 19, 247 (2012). [DOI: https://doi.org/10.4150/KPMI.2012.19.4.247]
- K. Hirota, H. Nakamura, T. Minowa, and M. Honshima, IEEE Trans. Magn., 42, 2909 (2006). [DOI: https://doi.org/10.1109/TMAG.2006.879906]
- M. Komuro, Y. Satsu, and H. Suzuki, IEEE Trans. Magn., 46, 3831 (2010). [DOI: https://doi.org/10.1109/TMAG.2010.2064780]
- H. Nakamura, K. Hirota, M. Shimao, T. Minowam, and M. Honshima, IEEE Trans. Magn., 41, 3844 (2005). [DOI: https://doi.org/10.1109/TMAG.2005.854874]
- G. Yan, P. J. McGuiness, J.P.G. Farr, and I. R. Harris, J. Alloys Compd., 491, L20 (2010). [DOI: https://doi.org/10.1016/j.jallcom.2009.10.202]
- M. Sagawa, S. Fujimura, H. Yamamoto, and Y. Matsuura, IEEE Trans. Magn., 20, 1584 (1984). [DOI: https://doi.org/10.1109/TMAG.1984.1063214]
- F. Viala, F. Joly, E. Nevalainen, M. Sagawa, K. Hiraga, and K. T. Park, J. Magn. Magn. Mater., 242, 1329 (2002). [DOI: https://doi.org/10.1016/S0304-8853(01)00967-2]
- W. Mo, L. Zhang, Q. Liu, A. Shan, J. Wu, and M. Komuro, Scripta Materialia, 59, 179 (2008). [DOI: https://doi.org/10.1016/j.scriptamat.2008.03.004]
- W. F. Li, T. Ohkubo, and K. Hono, Acta Materialia, 57, 1337 (2009). [DOI: https://doi.org/10.1016/j.actamat.2008.11.019]