Journal of the Korean Society for Aeronautical & Space Sciences (한국항공우주학회지)

The Korean Society for Aeronautical and Space Sciences (한국항공우주학회)
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Structural Reliability Evaluation on Solder Joint of BGA and TSSOP Components under Random Vibration using Reliability and Life Prediction Tool of Sherlock

신뢰성 수명예측 도구 Sherlock을 활용한 랜덤진동에서의 BGA 및 TSSOP 솔더 접합부의 구조 신뢰성 평가

  • Received : 2017.07.15
  • Accepted : 2017.11.06
  • Published : 2017.12.01
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Abstract

One of the failure mechanism of spaceborne electronics is a fatigue fracture on solder joint under launch random vibration. Thus, a necessity of early diagnosis through the fatigue life evaluation on solder joint arises to prevent such potential risk of failure. The conventional life prediction methods cannot assure the accuracy of life estimation results if the packaging type changes, and also requires much time and effort to construct the analysis model of highly integrated PCB with various packaging types. In this study, we performed life prediction of PCB based on a reliability and life prediction tool of sherlock as a new approach for evaluating the structural reliability on solder joint, and those prediction results were validated by fatigue tests. In addition, we also investigated an influence of solder height on the fatigue life of solder joint. These results indicated that the Sherlock is applicable tool for evaluating the structural reliability of spaceborne electronic.

우주용 전장품의 주요 고장 메커니즘 중 하나는 발사진동에 의한 기판의 반복적인 굽힘에 의한 솔더 접합부 피로파괴이며, 상기의 잠재적 위험요소에 대해 피로수명 평가를 통한 조기진단의 필요성이 증대되고 있다. 종래 연구에서 제안된 솔더부 수명예측 기법은 실장기법이 달라지면 예측결과의 정확성을 장담할 수 없으며, 다수의 실장기법이 적용된 고집적 기판의 유한요소모델 구축에 많은 시간과 노력이 수반되는 단점이 있다. 본 연구에서는 기존 연구의 한계점 극복을 위해 우주용 전장품 구조 신뢰성 평가의 새로운 접근법으로 상용 신뢰성 수명예측 도구인 Sherlock을 이용한 기판의 수명예측을 실시하고 발사진동 수명시험을 통해 분석결과의 타당성을 검증하였다. 또한 전자소자 및 솔더 높이에 따른 피로수명 영향성 분석을 통해 Sherlock이 우주용 전장품의 구조 신뢰성 평가에 있어서 유용한 도구임을 입증하였다.

Keywords

References

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