References
- Oppenheim, A., 1956, "Radiation analysis by the network method," Transactions of the American Society of Mechanical Engineers 78, 725-735.
- Incropera, F. P., Dewitt, D. P., Bergman, T. L., Lavine, A. S., 2007, Fundamentals of heat and mass transfer, 6th ed., John Wiley, Hoboken, NJ.
- Siegel, R., Howell, J. R., 2002, Thermal radiation heat transfer, Taylor & Francis, New York.
- http://www.thermalradiation.net/sectionc/C-41.html
- Badgwell, T. A., Trachtenberg, I., Edgar, T. F., 1994, "Modeling the wafer temperature profile in a multiwafer LPCVD furnace," Journal of the Electrochemical Society, 141(1), 161-172. https://doi.org/10.1149/1.2054678
- Kim, I. K., Kim, W. S., 1999, "Theoretical analysis of wafer temperature dynamics in a low pressure chemical vapor deposition reactor," International Journal of Heat and Mass Transfer, 42(22), 4131-4142. https://doi.org/10.1016/S0017-9310(99)00069-1
-
Munro, R. G., 1997, "Material properties of a sintered
${\alpha}$ -SiC," J. Phys. Chem. Ref. Data, 26(5), 1195-1203. https://doi.org/10.1063/1.556000 - Nilsson, O., Mehling, H., Horn, R., Fricke, J., Hofmann, R., Muller, S.G., Eckstein, R., Hofmann, D., 1997, "Determination of the thermal diffusivity and conductivity of monocrystalline silicon carbide (300-2300 K)," High Temp. High Press., 29(1), 73-79. https://doi.org/10.1068/htec142
-
Glassbrenner, C. J. and Glen A. Slack., 1964. "Thermal Conductivity of Silicon and Germanium from
$3^{\circ}$ K to the Melting Point," Physical Review, 134(4A), A1058-A69. https://doi.org/10.1103/PhysRev.134.A1058 - Kang, S.-H., Lee, S. H., Kim, B. H. and Ko, H. S., 2015, "Analysis and Visualization of Temperature Field for Wafer Batch in Furnace," Journal of The Korean Society of Visualization, 13(3), 24-28. https://doi.org/10.5407/JKSV.2015.13.3.024