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An Efficient Photoresist Stripping Process on the ITO Surface Using the Dipping Method

딥핑 방식을 이용한 ITO 표면의 효율적인 포토레지스트 박리공정

  • Kim, Joon Hyun (Mechanical and Automotive Engineering, Seoul National University of Science & Technology) ;
  • Sim, Jae Myung (Mechanical and Automotive Engineering, Seoul National University of Science & Technology) ;
  • Joo, Gi-Tae (Graduate School of NID Fusing Technology, Seoul National University of Science & Technology) ;
  • Kim, Young Sung (Graduate School of NID Fusing Technology, Seoul National University of Science & Technology) ;
  • Jeong, Byung Hyun (Eotech)
  • Received : 2016.07.08
  • Accepted : 2016.08.14
  • Published : 2016.08.15

Abstract

Agitation is a secondary process used to increase the PR stripping force on an ITO-glass surface; it is an efficient approach to stripping during production. It activates the stripper to chemically penetrate the PR layer and assists by breaking down the physical bonding forces at the surface. In this study, different stripping tests were conducted by varying the dipping time, the composition, the strip temperature, and the stripper concentration. Optimal PR strip conditions were estimated by using comparative visual inspection of stripped sample surfaces. The stripping process was affected by changes in the moving speeds and the sample positions. It was confirmed that the stripping capability improved at a dilute stripper ratio of 20-40% and a strip temperature of $30-40^{\circ}C$ and within 60 s of strip time.

Keywords

References

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