Journal of Applied Reliability (한국신뢰성학회지:신뢰성응용연구)

The Korean Reliability Society (한국신뢰성학회)
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Failure Modes Classification and Countermeasures of Stacked IC Packages

적층 IC 패키지의 고장모드 분류와 대책

  • Song, G.H. (Department of Industrial Engineering, Ajou University) ;
  • Jang, J.S. (Department of Industrial Engineering, Ajou University)
  • Received : 2016.11.09
  • Accepted : 2016.12.23
  • Published : 2016.12.25
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Abstract

Purpose: With the advance of miniaturization of electronic products, stacked packages of high density semiconductors are commonly used. Potential failure modes and mechanisms of stacked packages are identified. Methods: Failure modes and mechanisms of thin chip stacked packages are determined through the categorization and failure analysis: delamination, non-wet, crack, ESD, EMI and the process related damages. Results: Those failure modes are not easy to find and require excessive amount time and effort for analysis and subsequent improvement. Conclusion: In this study, a method of estimating the failure rate based on the strength measurement is suggested.

Keywords

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