참고문헌
- T. S. Kim, J. H. Kim, T. E. Kang, C. Y. Lee, H. B. Kang, M. K. Shin, C. Wang, B. Ma, U. Y. Jeong, T. S. Kim and B. J. Kim, "Flexible, Highly Efficient All-polymer Solar Cells", Nature Communications, 6, 8547 (2015). https://doi.org/10.1038/ncomms9547
- V. M. Marx, F. Toth, A. Wiesinger, J. Berger, C. Kirchlechner, M. J. Cordill, F. D. Fischer, F. G. Rammerstorferc and G. Dehm, "The Influence of a Brittle Cr Interlayer on the Deformation Behavior of Thin Cu Films on Flexible Substrates: Experiment and Model", Acta Materialia, 89, 278 (2015). https://doi.org/10.1016/j.actamat.2015.01.047
- S. Endler, H. Rempp, C. Harendt, and J. N. Burghartz, "Compensation of Externally Applied Mechanical Stress by Stacking of Ultra-Thin Chips", Proc. of 41st Euro. Solid-State Devi. Rese. Conf., 279 (2011).
- X. J. Sun, C. C. Wang, J. Zhang, G. Liu, G. J. Zhang, X. D. Ding, G. P. Zhang and J. Sun, "Thickness Dependent Fatigue Life at Microcrack Nucleation for Metal Thin Films on Flexible Substrates", J. Appl. Phys., 41, 195404 (2008).
- C. C. Lee, Y. S. Shih, C. S. Wu, C. H. Tsai, S. T. Yeh, Y. H. Peng and K. J. Chen, "Development of Robust Flexible OLED Encapsulations Using Simulated Estimations and Experimental Validations", J. Appl. Phys., 45, 27510 (2012).
- N. Palavesam, C. Landesberger and C. Kutter, "Finite Element Analysis of Uniaxial Bending of Ultra Thin Silicon Dies Embedded in Flexible Foil Substrates", Proc. 11th Microelectronics and Electronics (PRIME) Conference, Glasgow, 137, IEEE (2015).
- B. J. Kim, H. A. S. Shin, I. S. Choi and Y. C. Joo, "Electrical Failure and Damage Analysis of Multi-Layer Metal Films on Flexible Substrate During Cyclic Bending Deformation", IPFA 18th IEEE Inter. Symp., 2725 (2011).
- D. Wang, C. A. Volkert and O. Kraft, "Effect of Length Scale on Fatigue Life and Damage Formation in Thin Cu Films", Mater. Sci. Eng: A, 493(1), 267 (2008). https://doi.org/10.1016/j.msea.2007.06.092
- S. M. Lee, J. Y. Kwon, D. S. Yoon, H. D. Cho, J. H. You, Y. T. Kang, D. H. Choi and W. B. Hwang, "Bendability Optimization of Flexible Optical Nanoelectronics Via Neutral Axis Engineering", Nano. Rese. Lett., 7, 256 (2012). https://doi.org/10.1186/1556-276X-7-256
- M. Sugano, S. Machiya, M. Sato, T. Koganezawa, K. Shikimachi, N. Hirano and S. Nagaya, "Bending Strain Analysis Considering a Shift of the Neutral Axis for YBCO Coated Conductors With and Without a Cu Stabilizing Layer", Supercond. Sci. Technol., 24, 075019 (2011). https://doi.org/10.1088/0953-2048/24/7/075019
- D. A. van den Ende, H. J. van de Wiel, R. H. L. Kusters, A. Sridhar, J. F. M. Schram, M. Cauwe and J. van den Brand, "Bonding Bare Die LEDs on PET Foils for Lighting Applications Thermal Design Modeling and Bonding Experiments", Microelectron. Rel., 54, 2860 (2014). https://doi.org/10.1016/j.microrel.2014.07.125
- J. van den Brand, J. de Baets, T. van Mol and A. Dietzel, "Systems-in-Foil-Devices, Fabrication Processes and Reliability Issues", Microelectron. Rel., 48, 1123 (2008). https://doi.org/10.1016/j.microrel.2008.06.030
- J. Wolf, J. Kostelnik, K. Berschauer, A. Kugler, E. Lorenz, T. Gneiting, C. Harendt and Z. Yu, "Ultra-Thin Silicon Chips in Flexible Microsystems", ECWC13, (2014).
- S. Endler, S. Ferwana, H. Rempp, C. Harendt and J. N. Burghartz, "Two-Dimensional Flex Sensor Exploiting Stacked Ultrathin Chips", IEEE Elec. Devi. Lett., 33, 444 (2012). https://doi.org/10.1109/LED.2011.2178389
- F. Hou, X. Zhang, X. Guo, H. Xie, Y. Lu, L. Cao and L. Wan. "Thermo-mechanical reliability study for 3D package module based on flexible substrate", Proc. 14th International Conference on Electronic Packaging Technology (ICEPT), 1296, Dalian, IEEE (2013).
- B. J. Kim, M. H. Jeong, S. H. Hwan, H. Y. Lee, S. W. Lee, K. D. Chun, Y. B. Park and Y. C. Joo, "Relationship Between Tensile Characteristics and Fatigue Failure by Folding or Bending in Cu Foil on Flexible Substrate", J. Microelectron. Packag. Soc., 18(1), 55 (2011).
- B. J. Kim, "Reliability of Metal Electrode for Flexible Electronics", J. Microelectron. Packag. Soc., 20(4) 1 (2013). https://doi.org/10.6117/KMEPS.2013.20.4.001
- S. Kim and T. S. Kim, "Adhesion Reliability Enhancement of Silicon/Epoxy/Polyimide Interfaces for Flexible Electronics", J. Microelectron. Packag. Soc., 19(3), 63 (2012). https://doi.org/10.6117/kmeps.2012.19.3.063