정전척 표면의 온도 균일도 향상을 위한 냉매 유로 형상에 관한 연구

Study on Coolant Passage for Improving Temperature Uniformity of the Electrostatic Chuck Surface

  • 김대현 (한국기술교육대학교 대학원 메카트로닉스 공학부) ;
  • 김광선 (한국기술교육대학교 메카트로닉스 공학부)
  • Kim, Dae-Hyeon (Department of Mechatronics Engineering, Korea University of Technology and Education) ;
  • Kim, Kwang-Sun (Department of Mechatronics Engineering, Korea University of Technology and Education)
  • 투고 : 2016.09.11
  • 심사 : 2016.09.23
  • 발행 : 2016.09.30

초록

As the semiconductor production technology has gradually developed and intra-market competition has grown fiercer, the caliber of Si Wafer for semiconductor production has increased as well. And semiconductors have become integrated with higher density. Presently the Si Wafer caliber has reached up to 450 mm and relevant production technology has been advanced together. Electrostatic chuck is an important device utilized not only for the Wafer transport and fixation but also for the heat treatment process based on plasma. To effectively control the high calories generated by plasma, it employs a refrigerant-based cooling method. Amid the enlarging Si Wafers and semiconductor device integration, effective temperature control is essential. Therefore, uniformed temperature distribution in the electrostatic chuck is a key factor determining its performance. In this study, the form of refrigerant flow channel will be investigated for uniformed temperature distribution in electrostatic chuck.

키워드

참고문헌

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