반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

히트 파이프를 이용한 열경화성 나노임프린트 장비용 열판의 온도 균일도 향상

Improvement of Temperature Uniformity in a Hot Plate for Thermal Nanoimprint Lithography by Installing Heat Pipes

  • Park, Gyu Jin (Dept. of Mechanical Engineering, Kumoh National Institute of Technology) ;
  • Yang, Jin Oh (LG Chemistry Ltd.) ;
  • Lee, Jae Joong (Korea Institute of Machinery & Materials) ;
  • Kwak, Ho Sang (Dept. of Mechanical System Engineering, Kumoh National Institute of Technology)
  • 투고 : 2016.06.07
  • 심사 : 2016.06.22
  • 발행 : 2016.06.30
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

This study presents a thermal device specially designed for thermal nanoimprint lithography equipments, which requires the capability of rapid heating and cooling, high temperature uniformity and the material strength to endure high stamping pressure. The proposal to meet these requirements is a planar-type hot plate extensible to a large area, in which long circular cartridge heaters and heat pipes are installed inside in parallel. The heat pipes are connected to the outside water cooling chamber. A hot plate made of stainless steel is fabricated with a dimension $240mm{\times}240mm{\times}20mm$. Laboratory experiments are conducted to examine the thermal performance of the hot plate. The results illustrate that the employment of heat pipes leads to a notable enhancement of temperature uniformity in the device and provides an efficient heat delivery from the hot plate to outside. It is verified that the suggested hot plate could be a feasible thermal tool for thermal nanoimprint lithography, satisfying the major design requirements.

키워드

참고문헌

  1. Gary, S.M. and Simon, M.S., Fundamentals of Semiconductor Fabrication, John Wily & Sons, New York, 2003.
  2. Chou, S.Y., Krauss, P.R. and Renstrom, P.J., "Nanoimprint Lithography," J. Vac. Sci. Technol., Vol.14, No.6, pp.4129-4133, 1996. https://doi.org/10.1116/1.588605
  3. Becker, H. and Heim, U., "Hot Embossing as a Method for the Fabrication of Polymer High Aspect Ratio Structures," Sensors and Actuators A, Physical, Vol.84, pp.130-135, 2000.
  4. Pang, S.W., Tamamura, T., Nakao, M., Ozawa, A. and Masuda, H., "Direct Nano-Printing on Al Substrate Using a SiC Mold," J. Vac. Sci. Technol., Vol.16, pp.1145-1149, 1998.
  5. Hirai, Y., Fujiwara, M., Okuno, T., Tanaka, Y., Endo, M., Irie, S., Nakagawa, K. and Sasago, M., "Study of the Resist Deformation in Nanoimprint Lithography," J. Vac. Sci. Technol., Vol.19, pp.2811-2815, 2001. https://doi.org/10.1116/1.1415510
  6. Beck, M., Graczyk, M., Maximov, I., Sarwe, E.L., Ling, T.G.I., Keil, M. and Motelius, L., "Improving Stamps for 10 nm Level Wafer Scale Nanoimprint Lithography," Microelectron. Eng., Vol.61-2, pp.441-448, 2002. https://doi.org/10.1016/S0167-9317(02)00464-1
  7. Khang, D. Y., Kang, H., Kim, T. and Lee, H. H., "Low-Pressure Nanoimprint Lithography," Nano Lett., Vol.4, pp.633-637, 2004. https://doi.org/10.1021/nl049887d
  8. Ahn J. H., "Large Area Synthesis and Application of Graphene Films", Polymer Science and Technology, Vol.22, No.2, pp.126-129, 2011. https://doi.org/10.1002/pat.1816
  9. Lim H. J., Lee J. J., Choi K. B., Kim G. H., and Lee S. H., "Technology for Roll-based Nanoimprint Lithography Systems", (in Korean), J. of the Korea Soc. Manufacturing Process Engineers, Vol.12, No.5, pp.1-8., 2013. https://doi.org/10.14775/ksmpe.2013.12.6.001
  10. Kwak H. S., Park G. J., Son B. C., Lee J. J., and Park H. C., "Design of a Hot plate with Rapid Cooling Capability for Thermal Nanoimprint Lithography", Proc. SICE-ICASE Int. Joint Conf., Busan, pp.4897-4901, 2006.
  11. Park, G. J., Kwak, H. S., Shin, D. W. and Lee, J. J. "Numerical Simulation of Thermal Control of a Hot Plate for Thermal Nanoimprint Lithography Machines," Proc. 3rd Int. Conf. on Heating Cooling Technol., pp.321-327, 2007.
  12. Park, G. J., Lee, J. J. and Kwak, H. S, "A Numerical Study on Thermal Design of a Large-Area Hot Plate for Thermal Nanoimprint Lithography," J. Comput. Fluids Eng., Vol. 21, pp. 90-98, 2016.
  13. Lee S. Y., Cho H. H., and Lee Y. W., "A Study to Improve Temperature Uniformity in Hot plate Oven for Silicon Wafer Manufacturing", J. KSME(B), Vol. 25, pp.261-266, 2000.