반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

모바일 폰 카메라 패키지의 다이 본딩 에폭시가 Warpage와 광학성능에 미치는 영향 분석

Effect of Die Bonding Epoxy on the Warpage and Optical Performance of Mobile Phone Camera Packages

  • 손석우 (과학기술연합대학원대학교 측정과학과) ;
  • 김학용 (한국표준과학연구원 우주광학센터) ;
  • 양호순 (한국표준과학연구원 우주광학센터)
  • Son, Sukwoo (Science of Measurement, University of Science and Technology) ;
  • Kihm, Hagyong (Center for Space Optics, Korea Research Institute of Standards and Science) ;
  • Yang, Ho Soon (Center for Space Optics, Korea Research Institute of Standards and Science)
  • 투고 : 2016.09.27
  • 심사 : 2016.11.28
  • 발행 : 2016.12.31
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초록

The warpage on mobile phone camera packages occurs due to the CTE(Coefficient of Thermal Expansion) mismatch between a thin silicon die and a substrate. The warpage in the optical instruments such as camera module has an effect on the field curvature, which is one of the factors degrading the optical performance and the product yield. In this paper, we studied the effect of die bonding epoxy on the package and optical performance of mobile phone camera packages. We calculated the warpages of camera module packages by using a finite element analysis, and their shapes were in good agreement showing parabolic curvature. We also measured the warpages and through-focus MTF of camera module specimens with experiments. The warpage was improved on an epoxy with low elastic modulus at both finite element analysis and experiment results, and the MTF performance increased accordingly. The results show that die bonding epoxy affects the warpage generated on the image sensor during the packaging process, and this warpage eventually affects the optical performance associated with the field curvature.

키워드

참고문헌

  1. T. S. Yeung and M. M. F. Yuen, "Warpage of plastic IC packages as a function of processing condition," J. Electron. Packag., Vol. 123, pp. 268-272 , 1999.
  2. C. G. Song and S. H. Choa, "Numerical study of warpage and stress for the ultra thin package," J. Opt. Soc. Kor., Vol. 17, pp. 49-60, 2010.
  3. J. H. Park, Y. M. Koo, E. K. Kim and G. S. Kim, "A reliability and warpage of wafer level bonding for CIS device using polymer," J. Microelectron. Packag. Soc., Vol. 16, pp. 27-31, 2009.
  4. W. G. Kim, "Moisture absorption properties of liquid type epoxy encapsulant with nano-size silica for semiconductor packaging materials," J. Semiconductor & Display Technology, Vol. 9, pp. 33-39, 2010.
  5. M. Marchywka and D. G. Socker, "Modulation transfer function measurement technique for small-pixel detectors," Appl. Opt., Vol. 31, pp. 7198-7213, 1992. https://doi.org/10.1364/AO.31.007198
  6. M. Yamamoto and S. Horiuchi, "Simulation of modulation transfer function using a rendering method," Opt. Express, Vol. 21, pp. 7373-7383, 2013. https://doi.org/10.1364/OE.21.007373
  7. Y. Sawada, K. Harada and H. Fujioka, "Study of package warp behavior for high-performance flip-chip BGA," Microelectron. Reliab., Vol. 43, pp. 465-471, 2003. https://doi.org/10.1016/S0026-2714(02)00294-9
  8. W. Y. Kong, J. K. Kim, and M. F. Yuen, "Warpage in plastic package: effects of process conditions, geometry and materials," IEEE Trans. Electron. Packag. Manuf., Vol. 26, pp. 245-252, 2003. https://doi.org/10.1109/TEPM.2003.820806
  9. H. Y. Kihm, H.-S. Yang, I.-K. Moon, and Y.-W. Lee, "Athermal elastomeric Lens mount for space optics," J. Opt. Soc. Kor., Vol. 13, pp. 201-205, 2009. https://doi.org/10.3807/JOSK.2009.13.2.201
  10. W. Zhang, D. Wu, B. Su, S. A. Hareb, Y.C. Lee and B.P. Masterson, "The effect of underfill epoxy on warpage in flip-chip assemblies," IEEE Trans. Electron. Packag. Manuf., Vol. 21, pp. 323-329, 1998.
  11. M. Y. Tsai, C. H. Hsu and C. N. Han, "A note of Suhir's solution of thermal stresses for a die-substrate assembly," J. Electron. Packag., Vol. 126, pp. 115-119, 2004. https://doi.org/10.1115/1.1648056
  12. A. E. Hatheway. "Analysis of adhesive bonds in opitcs," Proc. SPIE, 1998, 2 (1993).
  13. JEDEC Standard JESD22-B112A, "Package warpage measurement of surface-mount integrated circuits at elevated temperature," JEDEC Solid State Technology Association, Arlington, 2009.
  14. J.-H. Kwon, H.-G. Rhee, Y.-S. Ghim and Y.-W. Lee, "Field-curvature correction according to the curvature of a CMOS image-sensor using air-gap optimization," J. Opt. Soc. Kor., Vol. 19, pp. 658-664, 2016.
  15. G. B. Kim, S. H. Moon, "An automatic focusing method using establishment of step size from optical axis interval," J. Semiconductor & Display Technology, Vol. 14, pp. 7-11, 2015
  16. ISO 12233:2000, "Photography-electronic still-picture cameras resolution measurements," 7-16, International Standard, Geneva, 2000.