한국기계가공학회지 (Journal of the Korean Society of Manufacturing Process Engineers)

  • 제15권1호
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  • Pages.26-33
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  • 2016
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  • 1598-6721(pISSN)
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  • 2288-0771(eISSN)
한국기계가공학회 (The Korean Society of Manufacturing Process Engineers)
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트위스트 다이아몬드 와이어의 성능향상을 위한 특성평가에 관한 연구

A Study on New Twist-Diamond Wire Characteristics for Improving Processing Performance

  • 박창용 (금오공과대학교 기계시스템공학과) ;
  • 권현규 (금오공과대학교 기계시스템공학과) ;
  • 팽발 (금오공과대학교 기계시스템공학과) ;
  • 정봉교 ((주)지엘테크)
  • 투고 : 2015.12.11
  • 심사 : 2015.12.30
  • 발행 : 2016.02.29
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초록

In this study, a new method to develop a fixed diamond wire for silicon wafer machining by the multi-wire cutting method was developed. The new twist diamond wire has improved performance with high breaking strength and chip flutes structure. According to these characteristics, the new twist diamond wire can be used in the higher speed multi-wire cutting process with a long lifetime. Except the design of the new structure, the twist diamond wire is coating by electroless-electroplating process. It is good for reducing breakage and the falling-off of diamond grains. Based on the silicon material removal mechanism and performance of the wire-cutting machine, the optimal processing condition of the new twist diamond wire has been derived via mathematical analysis. At last, through the tensile testing and the machining experiments, the performance of the twist diamond wire has been obtained to achieve the development goals and exceed the single diamond wire.

키워드

참고문헌

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