Textile Coloration and Finishing (한국염색가공학회지)

The Korean Society of Dyers and Finishers (한국염색가공학회)
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Comparative Analysis of Heat Sink and Adhesion Properties of Thermal Conductive Particles for Sheet Adhesive

열전도성 입자를 활용한 시트용 점착제의 점착 특성과 방열특성 연구

  • Kim, Yeong Su (Department of Materials Design Engineering, Kumoh National Institute of Technology) ;
  • Park, Sang Ha (Department of Polymer Science and Engineering, Kumoh National Institute of Technology) ;
  • Choi, Jeong Woo (Department of Polymer Science and Engineering, Kumoh National Institute of Technology) ;
  • Kong, Lee Seong (Department of Polymer Science and Engineering, Kumoh National Institute of Technology) ;
  • Yun, Gwan Han (Department of Polymer Science and Engineering, Kumoh National Institute of Technology) ;
  • Min, Byung Gil (Department of Polymer Science and Engineering, Kumoh National Institute of Technology) ;
  • Lee, Seung Han (kit Convergence Technology Research center, Kumoh National Institute of Technology)
  • 김영수 (금오공과대학교 소재디자인공학과) ;
  • 박상하 (금오공과대학교 에너지화학공학과) ;
  • 최정우 (금오공과대학교 에너지화학공학과) ;
  • 공이성 (금오공과대학교 에너지화학공학과) ;
  • 윤관한 (금오공과대학교 에너지화학공학과) ;
  • 민병길 (금오공과대학교 에너지화학공학과) ;
  • 이승한 (kit융합기술원)
  • Received : 2016.02.19
  • Accepted : 2016.03.15
  • Published : 2016.03.27
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Abstract

Improvement of heat sink technology related to the continuous implementation performance and extension of device-life in circumstance of easy heating and more compact space has been becoming more important issue as multi-functional integration and miniaturization trend of electronic gadgets and products has been generalized. In this study, it purposed to minimize of decline of the heat diffusivity by gluing polymer through compounding of inorganic particles which have thermal conductive properties. We used NH-9300 as base resin and used inorganic fillers such as silicon carbide(SiC), aluminum nitride(AlN), and boron nitride(BN) to improve heat diffusivity. After making film which was made from 100 part of acrylic resin mixed hardener(1.0 part more or less) with inorganic particles. The film was matured at $80^{\circ}C$ for 24h. Diffusivity were tested according to sorts of particles and density of particles as well as size and structure of particle to improve the effect of heat sink in view of morphology assessing diffusivity by LFA(Netzsch/LFA 447 Nano Flash) and adhesion strength by UTM(Universal Testing Machine). The correlation between diffusivity of pure inorganic particles and composite as well as the relation between density and morphology of inorganic particles has been studied. The study related morphology showed that globular type had superior diffusivity at low density of 25% but on the contarary globular type was inferior to non-globular type at high density of 80%.

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References

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