Current Photovoltaic Research

Korea Photovoltaic Society (한국태양광발전학회)
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Fabrication of Core-Shell Structure of Ni/Au Layer on PMMA Micro-Ball for Flexible Electronics

  • Hong, Sung-Jei (Display Materials and Components Research Center, Korea Electronics Technology Institute) ;
  • Jeong, Gyu-Wan (JEONGEUI Industry Co. Ltd.) ;
  • Han, Jeong-In (Department of Chemical and Biochemical Engineering, Dongguk University-SEOUL)
  • Received : 2016.09.02
  • Accepted : 2016.09.06
  • Published : 2016.12.31
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Abstract

In this paper, core-shell structure of nickel/gold (Ni/Au) conductive layer on poly-methyl-methacrylate (PMMA) micro-ball was fabricated and its conduction property was investigated. Firstly, PMMA micro-ball was synthesized by using dispersion polymerization method. Size of the ball was $2.8{\mu}m$ within ${\pm}7%$ deviation, and appropriate elastic deformation of the PMMA micro-ball ranging from 31 to 39% was achieved under 3 kg pressure. Also, 200 nm thick Ni/Au conductive layer was fabricated on the PMMA micro-ball by uniformly depositing with electroless-plating. Adhesion of the conductive layer was optimized with help of surface pre-treatment, and the layer adhered without peeling-off despite of thermal expansion by collision with accelerated electrons. Composite paste containing core-shell structured particles well cured at low temperature of $130^{\circ}C$ while pressing the test chip onto the substrate to make electrical contact, and electrical resistance of the conductive layer showed stable behavior of about $6.0{\Omega}$. Thus, it was known that core-shell structured particle of the Ni/Au conductive layer on PMMA micro-ball was feasible to flexible electronics.

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References

  1. Jiang, X., Zhang, R., Yang, T., Lin, S., Chena, Q., Zhen, Z., Xie, D. and Zhu. H., "Foldable and electrically stable graphene film resistors prepared by vacuum filtration for flexible electronics", Surf. Coat. Technol. Vol. 299, pp. 22-28, 2016. https://doi.org/10.1016/j.surfcoat.2016.04.066
  2. Lin, Q., Huang, H., Jing, Y., Fu, H., Chang, P., Li, D., Yao, Y. and Fan, Z., "Flexible photovoltaic technologies", J. Mater. Chem. C Vol. 2, pp. 1233-1247, 2014. https://doi.org/10.1039/c3tc32197e
  3. Lee, K.-M., Lin, L.-C., Chen, C.-Y., Suryanarayananc, V. and Wub, C.-G., "Preparation of High Transmittance Platinum Counter Electrode at an Ambient Temperature for Flexible Dye-Sensitized Solar Cells", Electrochim. Acta Vol. 135, pp. 578-584, 2014. https://doi.org/10.1016/j.electacta.2014.05.004
  4. Vries, J. d., Delft, J. v. and Slob, C., "100 lm Pitch flip chip on foil assemblies with adhesive interconnections", Microelec. Reli. Vol. 45, pp. 527-534, 2005. https://doi.org/10.1016/j.microrel.2004.06.006
  5. Islam, R. A. and Chan, Y. C., "Effect of microwave preheating on the bonding performance of flip chip on flex joint", Microelec. Reli. Vol. 44, Iss. 5, pp. 815-821, 2004. https://doi.org/10.1016/j.microrel.2003.08.014
  6. Wu, H.-T., Ding, C.-C. and Chen, K.-J., "Preparation of monodispersed PMMA particles and composite particles containing pigment green 36 by dispersion polymerization", J. Taiwan Inst. Chem. Eng. Vol. 44, Iss. 4, pp. 691-699, 2013. https://doi.org/10.1016/j.jtice.2012.12.026
  7. Horak, D., Svec, F. and Frechet, J. M. J., "Preparation of colored poly(styrene-co-butyl methacrylate) micrometer size beads with narrow size distribution by dispersion polymerization in presence of dyes", J. Polym. Sci. Polym. Chem. A Vol. 33, Iss. 17, pp. 2961-2968, 1995. https://doi.org/10.1002/pola.1995.080331714
  8. Shen, S., Sudol, E. D. and El-Aasser, M. S., "Control of particle size in dispersion polymerization of methyl methacrylate", J. Polym. Sci. Polym. Chem. A Vol. 31, Iss. 6, pp. 1393-1402, 1993. https://doi.org/10.1002/pola.1993.080310606
  9. Shen, S., Sudol, E. D. and El-Aasser, M. S., "Dispersion polymerization of methyl methacrylate: Mechanism of particle formation", J. Polym. Sci. Polym. Chem. A, Vol. 32, Iss. 6, pp. 1087-1100, 1994. https://doi.org/10.1002/pola.1994.080320611
  10. Paine, A. J., Luymes, W. and McNulty, J., "Dispersion polymerization of styrene in polar solvents. 6. Influence of reaction parameters on particle size and molecular weight in poly(N-vinylpyrrolidone)-stabilized reactions", Macromolecules Vol. 23, Iss. 12, pp. 3104-3109, 1990. https://doi.org/10.1021/ma00214a012
  11. Mendelev, M. I. and Srolovitz, D. J., "Impurity effects on grain boundary migration", Mod. Sim. Mat. Sci. Eng., Vol. 10, Iss. 6, R79-R110, 2002. https://doi.org/10.1088/0965-0393/10/6/201
  12. Çaykara, T. and Güven, O, "UV degradation of poly(methyl methacrylate) and its vinyltriethoxysilane containing copolymers", Polym. Deg. Stab. Vol. 65, Iss. 2, pp. 225-229, 1999. https://doi.org/10.1016/S0141-3910(99)00008-7
  13. Yin, C. Y., Alam, M. O., Chan, Y. C., Bailey, C. and Lu, H., "The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications", Microelec. Reli. Vol. 43, Iss. 4, pp. 625-633, 2003. https://doi.org/10.1016/S0026-2714(02)00348-7
  14. Kim, J. H., Seol, Y. G. and Lee, N.-E., "Adhesion Properties of Electroless-Plated Cu Layers on Polyimide Treated by Inductively Coupled Plasmas", J. Kor. Phys. Soc. Vol. 51, pp. S187-S192, 2007. https://doi.org/10.3938/jkps.51.187
  15. Bhusari, D., Hayden, H., Tanikella, R., Allen, S. A. B. and Kohl, P. A., "Plasma Treatment and Surface Analysis of Polyimide Films", J. Electrochem. Soc. Vol. 152, Iss. 10, pp. F162-F170, 2005. https://doi.org/10.1149/1.2006587
  16. Park, J. H. , Lee, N.-E., Lee, J. C., Park, J. S. and Park, H. D., "Continuous and Cyclic Deep Reactive Ion etching of Borosilicate Glass by Using SF6 and SF6/Ar Inductively Coupled Plasmas", J. Korean Phys. Soc. Vol. 47, pp. S422-S428, 2005.
  17. Fujii, S., Hamasaki, H., Takeoka, H., Tsuruoka, T., Akamatsu, K. and Nakamura, Y., "Electroless nickel plating on polymer particles", J. Coll. Interf. Sci. Vol. 430, pp. 47-55, 2014. https://doi.org/10.1016/j.jcis.2014.05.041
  18. Masuku, E. S., Mileham, A. R., Hardisv, H. Bramley, A. N., Joha, C. and Detassis, P., "A Finite Element Simulation of the Electroplating Process", CIRP Annals - Manufact. Technol. Vol. 51, Iss. 1, pp. 169-172, 2002. https://doi.org/10.1016/S0007-8506(07)61492-9
  19. Lin, K.-J., Wu, H.-M., Yu, Y.-H., Ho, C.-Y., Wei, M.-H., Lu, F.-H. and Tseng, W. J., "Preparation of PMMA-Ni core-shell composite particles by electroless plating on polyelectrolytemodified PMMA beads", Appl. Surf. Sci. Vol. 282, pp. 741-745, 2013. https://doi.org/10.1016/j.apsusc.2013.04.175
  20. Uddin, R. M. A., Alam, M. O., Chan, Y. C. and Chan, H. P., "Adhesion strength and contact resistance of flip chip on flex packages-effect of curing degree of anisotropic conductive film" Microelec. Reli. Vol. 44, pp. 505-514, 2004. https://doi.org/10.1016/S0026-2714(03)00185-9
  21. Gao, M.-Z., Job, R., Xue, D.-S. and Fahrner, W. R., "Thickness Dependence of Resistivity and Optical Reflectance of ITO Films", Chin. Phys. Lett. Vol. 25, Iss. 4, pp. 1380-1383, 2008. https://doi.org/10.1088/0256-307X/25/4/059