Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Chemical Vapor Deposition of Inorganic Thin Films using Atmospheric Plasma : A Review of Research Trend

상압 플라즈마를 이용한 무기박막의 화학기상 증착법에 대한 연구동향

  • Kim, Kyong Nam (School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU)) ;
  • Lee, Seung Min (School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU)) ;
  • Yeom, Geun Young (School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU))
  • 김경남 (성균관대학교 신소재공학부) ;
  • 이승민 (성균관대학교 신소재공학부) ;
  • 염근영 (성균관대학교 신소재공학부)
  • Received : 2015.10.14
  • Accepted : 2015.10.30
  • Published : 2015.10.31
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Abstract

In recent years, the cleaning and activation technology of surfaces using atmospheric plasma as well as the deposition technology for coating using atmospheric plasma have been demonstrated conclusively and drawn increasing industrial attention. Especially, due to the simplicity, the technology using atmospheric plasma enhanced chemical vapor deposition has been widely studied from many researchers. The plasma source type commonly used as the stabilization of diffuse glow discharges for atmospheric pressure plasma enhanced chemical vapor deposition pressure is the dielectric barrier discharge. In this review paper, some kinds of modified dielectric barrier discharge type will be presented. And, the characteristics of silicon based compound such as SiOx and SiNx deposited using atmospheric plasma enhanced chemical vapor system will be discussed.

Keywords

References

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