Experimental study on micro-hole drilling with high aspect ratio using picosecond laser

피코초 레이저를 이용한 고세장비 미세 홀가공의 실험적 연구

  • Oh, Bukuk (Production engineering Research Institute, LG Electronics) ;
  • Kim, Jongki (Production engineering Research Institute, LG Electronics) ;
  • Kim, Dooyoung (Production engineering Research Institute, LG Electronics) ;
  • Lee, Seungkey (Production engineering Research Institute, LG Electronics) ;
  • Jeong, Soohoa (Production engineering Research Institute, LG Electronics) ;
  • Hong, Michael (Production engineering Research Institute, LG Electronics)
  • Received : 2015.06.20
  • Accepted : 2015.06.26
  • Published : 2015.06.30

Abstract

Pressure-drop in a micro-channel is critical when a hole diameter is less then 100um with the high aspect ratio, more than 40. To minimize these pressure loss for micro-channel applications is important and there would be the best hole diameter, taper angle, and their combinations. In this work, the parametric study for laser drilling of anodized material is conducted to obtain the micro-channel hole with high aspect ratio.

Keywords

References

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