DOI QR코드

DOI QR Code

Development of High-Temperature Solders: Contribution of Transmission Electron Microscopy

  • Bae, Jee-Hwan (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Shin, Keesam (School of Nano and Advanced Materials Engineering, Changwon National University) ;
  • Lee, Joon-Hwan (Advanced Materials & Device Lab., Corporate R&D Institute, Samsung Electro-Mechanics Co.) ;
  • Kim, Mi-Yang (Advanced Materials & Device Lab., Corporate R&D Institute, Samsung Electro-Mechanics Co.) ;
  • Yang, Cheol-Woong (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
  • Received : 2015.06.22
  • Accepted : 2015.06.26
  • Published : 2015.06.30

Abstract

This article briefly reviews the results of recently reported research on high-temperature Pb-free solder alloys and the research trend for characterization of the interfacial reaction layer. To improve the product reliability of high-temperature Pb-free solder alloys, thorough research is necessary not only to enhance the alloy properties but also to characterize and understand the interfacial reaction occurring during and after the bonding process. Transmission electron microscopy analysis is expected to play an important role in the development of high-temperature solders by providing accurate and reliable data with a high spatial resolution and facilitating understanding of the interfacial reaction at the solder joint.

Keywords

References

  1. Aksoz S, Ocak Y, Marasli N, and Keslioglu K (2011) Determination of thermal conductivity and interfacial energy of solid Zn solition in the Zn-Al-Bi eutectic system. Exp. Therm. Fluid. Sci. 35, 395-404. https://doi.org/10.1016/j.expthermflusci.2010.11.001
  2. Chen S W, Chem P Y, and Wang C H (2006) Lowering of Sn-Sb alloy melting points caused by substrate dissolution. J. Electron. Mater. 35, 1982-1985. https://doi.org/10.1007/s11664-006-0303-x
  3. Chen S W, Zi A, Chen P, Wu H, Chen Y, and Wang C (2008) Interfacial reactions in the Sn-Sb/Ag and Sn-Sb/Cu couples. Mater. Chem. Phys. 111, 17- 19. https://doi.org/10.1016/j.matchemphys.2008.04.018
  4. Cheng F, Gao F, Wang Y, Wu Y, Ma Z, and Yang J (2012) Sn addition on the tensile properties of high temperature Zn-4Al-3Mg solder alloys. Microelectron. Reliab. 52, 579-584. https://doi.org/10.1016/j.microrel.2011.10.003
  5. El-Daly A A, Fawzy A, Mohamad A Z, and El-Taher A M (2011a) Microstructural evolution and tensile properties of Sn-5Sb solder alloy containing small amount of Ag and Cu. J. Alloy. Compd. 509, 4574-4582. https://doi.org/10.1016/j.jallcom.2011.01.109
  6. El-Daly A A, Mohamad A Z, Fawzy A, and El-Taher A M (2011b) Creep behavior of near-peritectic Sn-5Sb solders containing small amounts of Ag and Cu. Mater. Sci. Eng. A 528, 1055-1062. https://doi.org/10.1016/j.msea.2010.11.001
  7. Gancarz T, Pstrus J, Fima P, and Mosinska S (2012) Thermal properties and wetting behavior of high temperature Zn-Al-In solders. J. Mater. Eng. Perform. 21, 599-605. https://doi.org/10.1007/s11665-012-0146-y
  8. Geranmayeh A R and Mahmudi R (2005) Power law identation creep of Sn-5%Sb solder alloy. J. Mater. Sci. 40, 3361-3366. https://doi.org/10.1007/s10853-005-0421-5
  9. Haque A, Lim B H, Haseeb A S M A, and Masjuki H H (2012) Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame. J. Mater. Sci.: Mater. Electron. 23, 115-123. https://doi.org/10.1007/s10854-011-0511-x
  10. Haque A, Won Y S, Haseeb A S M A, and Masjuki H H (2010a) Investigations on Zn-Al-Ge alloys as high temperature die attach material. Electronic System-Integration Technology Conference (ESTC) 3, 1-5.
  11. Haque A, Won Y S, Lim B H, Haseeb A S M A, and Masjuki H H (2010b) Effect of Ni metallization on interfacial reactions and die attach properties of Zn-Al-Mg-Ga high temperature lead-free solder. International Electronic Manufacturing Technology Conference 34, 1-6.
  12. Hui W, Siyuan H, Xuming C, and Deping H (2009) Interfacial structure and mechanical properties of aluminium foam joints fluxless-soldered with Zn-Al-Cu base alloy. Acta Metall. Sin. 45, 723-728.
  13. Iseki T and Takamori M (2012) Development of Bi-based Pb-free solders for high-temperature. J. Jpn. Inst. Electron. Pack. 15, 153-157. https://doi.org/10.5104/jiep.15.153
  14. Kang N H, Na H S, Kim S J, and Kang C Y (2009) Alloy design of Zn-Al-Cu solder for ultra high temperatures. J. Alloy. Compd. 467, 246-250. https://doi.org/10.1016/j.jallcom.2007.12.048
  15. Karakaya I and Thompson W T (1993) The Ag-Bi (silver-bismuth) system. J. Phase Equilib. 14, 525-530. https://doi.org/10.1007/BF02671975
  16. Kim S J, Kim K S, Kim S S, Kang C Y, and Suganuma K (2008) Characteristics of Zn-Al-Cu alloys for high temperature solder application. Mater. Trans. 49, 1531-1536. https://doi.org/10.2320/matertrans.MF200809
  17. Kim S, Kim K S, Kim S S, and Suganuma K (2009b) Interfacial reaction and die attach properties of Zn-Sn high-temperature solders. J. Electron. Mater. 38, 266-272. https://doi.org/10.1007/s11664-008-0550-0
  18. Kim S, Kim K S, Kim S S, Suganuma K, and Izuta G (2009a) Improving the reliability of Si die attachment with Zn-Sn-based high-temperature Pb-free solder using a TiN diffusion barrier. J. Electron. Mater. 38, 2688-2675. https://doi.org/10.1007/s11664-009-0928-7
  19. Lee J E, Kim K S, Suganuma K, Takenaka J, and Hagio K (2005) Interfacial properties of Zn-Sn alloys as high temperature lead-free solder on Cu substrate. Mater. Trans. 46, 2413-2418. https://doi.org/10.2320/matertrans.46.2413
  20. Mahmudi R and Eslami E (2010) Inpression creep behavior of Zn-Sn hightemperature lead-free solders. J. Electron. Mater. 39, 2495-2502. https://doi.org/10.1007/s11664-010-1359-1
  21. Moser Z, Dutkiewicz J, Gasior W, and Salawa J (1985) The Sn-Zn (tin-zinc) system. Bull. Alloy Phase Diagrams 6, 330-334. https://doi.org/10.1007/BF02880511
  22. Murray J L (1983) The Al-Zn (aluminum-zinc) system. Bull. Alloy Phase Diagrams 4, 55-73. https://doi.org/10.1007/BF02880321
  23. Okamoto H (2012) Sb-Sn (antimony-tin). J. Pahse Equilib. Diff. 33, 347. https://doi.org/10.1007/s11669-012-0054-8
  24. Santos W L R, Brito C, Quaresma J M V, Spinelli J E, and Garcia A (2014) Platelike cell growth during directional solidification of a Zn-20wt%Sn hightemperature lead-free solder alloy. Mater. Sci. Eng. B 182, 29-36. https://doi.org/10.1016/j.mseb.2013.11.016
  25. Shi Y, Fang W, Xia Z, Lei Y, Guo F, and Li X (2010) Investigation of rare earthdoped BiAg high-temperature solders. J. Mater. Sci.-Mater. El. 21, 875-881. https://doi.org/10.1007/s10854-009-0010-5
  26. Shimizu T, Ishikawa H, Ohnuma I, and Ishida K (1999) Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use. J. Electron. Mater. 28, 1172-1175. https://doi.org/10.1007/s11664-999-0153-4
  27. Song J M, Chuang H Y, and Wen X T (2007a) Thermal and tensile properties of Bi-Ag alloys. Metall. Mater. Trans. A 38, 1371-1375. https://doi.org/10.1007/s11661-007-9138-1
  28. Song J M, Chuang H Y, and Wu Z M (2006) Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates. J. Electron. Mater. 35, 1041-1049. https://doi.org/10.1007/BF02692565
  29. Song J M, Chuang H Y, and Wu Z M (2007b) Substrate dissolution and shear properties of the joints between Bi-Ag alloys and Cu substrate for high-temperature soldering applications. J. Electron. Mater. 36, 1516-1523. https://doi.org/10.1007/s11664-007-0222-5
  30. Stadelmann P A (1987) EMS - a software package for electron diffraction analysis and HREM image simulation in materials science. Ultramicroscopy 21, 131-145. https://doi.org/10.1016/0304-3991(87)90080-5
  31. Suganuma K (2004) Lead-Free Soldering in Electronics (Marcel Dekker, New York).
  32. Suganuma K, Kim S J, and Kim K S (2009) High-temperature lead-free solders: properties and possibilities. JOM-US. 61, 64-71.
  33. Takahashi T, Komatsu S, Nishikawa H, and Takemoto T (2010) Improvement of high-temperature performance of Zn-Sn solder joint. J. Electron. Mater. 39, 1241-1247. https://doi.org/10.1007/s11664-010-1233-1
  34. Takaku Y, Felicia L, Ohnuma I, Kainuma R, and Ishida K (2008) Interfacial reaction between Cu substrates and Zn-Al base high-temperature Pbfree solders. J. Electron. Mater. 37, 314-323. https://doi.org/10.1007/s11664-007-0344-9
  35. Takaku Y, Makino K, Watanabe K, Ohnuma I, Kainuma R, Yamada Y, Yagi Y, Nakagawa I, Atsumi T, and Ishida K (2009) Interfacial reaction between Zn-Al-based high-temperature solders and Ni substrate. J. Electron. Mater. 38, 54-60. https://doi.org/10.1007/s11664-008-0528-y
  36. Vianco P T (2002) Solder technology for ultra high temperatures. Weld. J. 81, 51-54.
  37. Wang C, Chen H, and Li P (2012) Interfacial reactions of high-temperature Zn-Sn solders with Ni substrate. Mater. Chem. Phys. 136, 325-333. https://doi.org/10.1016/j.matchemphys.2012.03.057

Cited by

  1. Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates vol.46, pp.4, 2017, https://doi.org/10.1007/s11664-016-5272-0