Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Effects of Electrodeposition Conditions on Properties of Ni Thin Films Electrodeposited from Baths Fabricated by Dissolving Metal Ni Powders

금속 Ni 분말을 용해한 도금용액으로부터 전기도금 된 Ni 박막 특성에 미치는 도금조건의 영향

  • Yoon, Pilgeun (Department of Advanced Materials Engineering, Hanbat National University) ;
  • Park, Keun-Yong (Department of Advanced Materials Engineering, Hanbat National University) ;
  • Uhm, Young Rang (Korea Atomic Energy Research Institute) ;
  • Choi, Sun Ju (Korea Atomic Energy Research Institute) ;
  • Park, Deok-Yong (Department of Advanced Materials Engineering, Hanbat National University)
  • 윤필근 (한밭대학교 신소재공학과) ;
  • 박근용 (한밭대학교 신소재공학과) ;
  • 엄영랑 (한국원자력연구원 동위원소 이용기술 개발부) ;
  • 최선주 (한국원자력연구원 동위원소 이용기술 개발부) ;
  • 박덕용 (한밭대학교 신소재공학과)
  • Received : 2015.06.16
  • Accepted : 2015.06.29
  • Published : 2015.06.30
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Abstract

Chloride plating solution was fabricated by dissolving metal Ni powders in solution with HCl and deionized water. Effects of deposition conditions on the properties of Ni films electrodeposited from chloride baths were studied. Current efficiency of Ni films electrodeposited from the baths containing saccharin was decreased with increasing the current density. Residual stress of Ni thin films ware measured to be about 230 ~ 435 MPa in the range of current density of $10{\sim}25mA/cm^2$. Cathode current efficiency in baths without saccharin was initially increased with increasing pH, while it was decreased with increasing pH further. Cathode current efficiency in baths with saccharin (except at pH 2) exhibited less 10 ~ 20% than that in baths without saccharin. Residual stress of Ni films electrodeposited from baths without saccharin was measured to be 388 ~ 473 MPa in the range of pH 2 ~ pH 5 and then was increased to 551 MPa at pH 6. On the other hand, residual stress of Ni films electrodeposited from baths with saccharin was increased with increasing pH. Surface morphology was strongly affected by the change of current density, but slightly by solution pH and addition of saccharin.

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References

  1. M. Petec, J. S. Wike, B. P. Phillips, C. A. Sampson, Chemical Technology Division, "Plating Nickel-63 on Copper Coupons" (1989).
  2. S. D. Cooper, M. A. Moseley, E. D. Pellizzari, Anal. Chem. 57(13) (1985) 2469. https://doi.org/10.1021/ac00290a010
  3. M. Kumar, J. Udhayakumar, S. S. Gandhi, A. K. Satpati, A. Dash, M. Venkatesh, Appl. Rad. Isot. 67 (2009) 1042. https://doi.org/10.1016/j.apradiso.2009.01.078
  4. J. L. Steeb, "Nickel-63 Microirradiators and Applications" Ph.D. Thesis, Georgia Institute of Technology (2010).
  5. J. W. Judy, R. S. Muller, H. H. Zappe, J. Microelectromech. Syst. 4 (1995) 162. https://doi.org/10.1109/84.475542
  6. J. W. Judy, R. S. Muller, J. Microelectromech. Syst. 6 (1997) 249. https://doi.org/10.1109/84.623114
  7. D.-Y. Park, J. Korean. Electro-chem. Soc. 14 (2011) 163. https://doi.org/10.5229/JKES.2011.14.3.163
  8. K. -Y. Park, Y. R. Uhm, S. J. Choi, D. -Y. Park, J. Kor. Magn. Soc. 23(1) (2013) 12. https://doi.org/10.4283/JKMS.2013.23.1.012
  9. D. -Y. Park, K. S. Park, J. M. Ko, D. -H. Cho, S. H. Lim, W. Y. Kim, B. Y. Yoo, N. V. Myung, J. Electrochem. Soc., 153(12) (2006) C814. https://doi.org/10.1149/1.2353792
  10. J. W. Dini, Electrodeposition-The Materials Science of Coatings and Substrates, Noyes Publ. Park Ridge, NJ (1993) pp. 339 and 331.
  11. B. -Z. Lee, D. N. Lee, Acta Mater., 46 (1998) 3701. https://doi.org/10.1016/S1359-6454(98)00045-7
  12. K. -N. Tu, J. W. Mayer, L. C. Feldman (Eds.), Electronic Thin Film Science for Electrical Engineers and Materials Scientists, Macmillan Publishing Company, New York, New York, 1992, Chap. 4.
  13. Modern Electroplating, 4th ed., G. A. Di Bari, M. Schlesinger, M. Paunovic, Editors, pp. 139-199, Wiley-Interscience, New York (2000).
  14. R. Weil, Plating, 58 (1971) 50.
  15. I. Kim, P.F. Mentone, Electrochim. Acta, 52 (2006) 1805. https://doi.org/10.1016/j.electacta.2006.01.083
  16. P. Zentner, Brenner, Jennings, Plating, 39, 865 (1952) 1229.
  17. D. Kim, D. -Y. Park, B. Y. Yoo, P.T.A. Sumodjo, N.V. Myung, Electrochim. Acta 48 (2003) 819. https://doi.org/10.1016/S0013-4686(02)00773-9
  18. P. C. Crouch, H. V. Hendricksen, Trans. Institute of Metal Finishing, 61, 133(1983) https://doi.org/10.1080/00202967.1983.11870652
  19. D. -Y. Park, R. Y. Song, J. M. Ko, B. Y. Yoo, N.V . Myung, Electrochem. Solid-State Lett., 8 (2) C23-C25 (2005) https://doi.org/10.1149/1.1843711