참고문헌
- Hung, K., Chan, Y., Ong, H., Tu, P., and Tang, C., "Effect of Pinhole Au/Ni/Cu Substrate on Self-Alignment of Advanced Packages," Materials Science and Engineering: B, Vol. 76, No. 2, pp. 87-94, 2000. https://doi.org/10.1016/S0921-5107(00)00413-X
- Kim, S. S., "Development of Roll CMP Machine for Large Area Micropatterns and Polishing Characteristics," M.S, Thesis, Graduate School of Mechanical Engineering, Pusan National University, 2013.
- Lee, H., Wang, H., Park, J., and Jeong, H., "Experimental Investigation of Process Parameters for Roll-Type Linear Chemical Mechanical Polishing (Roll-CMP) System," Precision Engineering, Vol. 38, No. 4, pp. 928-934, 2014. https://doi.org/10.1016/j.precisioneng.2014.06.003
- Coppeta, J., Rogers, C., Philipossian, A., and Kaufman, F., "Characterizing Slurry Flow during CMP Using Laser Induced Fluorescence," Proc. of the 2nd International Chemical Mechanical Polish Planarization for ULSI Multilevel Interconnection Conference, 1997.
- Joo, S. B., Lee, H. L., and Jeong, H. D., "Analysis of Cu CMP according to the Variation of Corrosion Inhibitor Concentration," Proc. of KSMPE Spring Conference, pp. 121-124, 2008.
- Ninomiya, S., Qiang, F., Shimizu, T., Iwai, M., Uematsu, T., et al., "Application of a Floating Nozzle to Grinding Process Using an Edge of Grinding Wheel," Key Engineering Materials, Vol. 389-390, pp. 326-331, 2009. https://doi.org/10.4028/www.scientific.net/KEM.389-390.326
- Jeong, Y. S., Kim, H. J., and Jeong, H. D., "The Effect of Slurry Flow Rate and Temperature on CMP Characteristic," J. Korean Soc. Precis. Eng., Vol. 21, No. 11, pp. 46-52, 2004.
- Park, J.-H., Kinoshita, M., Yoshida, K., Matsumura, S., and Jeong, H.-D., "Stability and Improvement of Polishing Pad in W CMP," Journal of the Korean Institute of Electrical and Electronic Material Engineers, Vol. 20, No. 12, pp. 1027-1033, 2007. https://doi.org/10.4313/JKEM.2007.20.12.1027
- Lee, S. H., Kim, H. J., Ahn, D. G., and Jeong, H. D., "A Study on Novel Conditioning for CMP," J. Korean Soc. Precis. Eng., Vol. 16, No. 5, pp. 40-47, 1999.
- Wang, H., Lee, H. S., and Jeong, H. D., "Statistical Analysis on Process Variables in Linear Roll-CMP," Journal of the Korean Society of Tribologists and Lubrication Engineers, Vol. 30, No. 3, pp 139-145, 2014. https://doi.org/10.9725/kstle.2014.30.3.139
- Yang, W.-Y., Yang, J.-C., and Sung, I.-H., "A Study of the Effects of Pressure Velocity and Fluid Viscosity in Abrasive Machining Process," Journal of the Korean Society of Tribologists and Lubrication Engineers, Vol. 27, No. 1, pp. 7-12, 2011. https://doi.org/10.9725/kstle.2011.27.1.007