Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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A Study on the Polishing Characteristics Using Floating Nozzle in Linear Roll CMP

선형 롤 CMP에서 플로팅 노즐을 이용한 연마 특성에 관한 연구

  • Lee, Chiho (School of Mechanical Engineering, Pusan National University) ;
  • Jeong, Haedo (School of Mechanical Engineering, Pusan National University)
  • Received : 2015.04.24
  • Accepted : 2015.05.29
  • Published : 2015.07.01
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Abstract

Conventional etching technology is in the face of problems such as dishing, erosion resulting from non-uniform removal of film. Advanced printed circuit board (PCB) requires accurate wire formation with the aid of planarization by chemical mechanical polishing (CMP). Linear roll CMP is a line contact continuous process which removes the film by pressurization and rotation while slurry is supplied to polishing pad attached to the roll. This paper focuses on the design of floating nozzle on the linear roll CMP equipment which makes the slurry supply uniformly on the roll pad. Experimental results show that removal rate using the floating nozzle increases 3 times higher than that without it and non-uniformity is less than 15%.

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References

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