Journal of the Korean Society of Manufacturing Process Engineers (한국기계가공학회지)

The Korean Society of Manufacturing Process Engineers (한국기계가공학회)
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Carrier Design by Temperature Distribution Analysis in Chamber of ITO Deposition Inline Sputter

ITO 증착용 인라인 챔버 온도 분포해석에 의한 캐리어장치의 설계

  • Lee, Sang-Jae (Department of Electronic Engineering, Kumoh National Institute of Technology) ;
  • Choi, Ju-Ran (Department of intelligent Mechanical Engineering, Graduated School of Kumoh National Institute of Technology) ;
  • Choi, Seong-Dae (Department of intelligent Mechanical Engineering, Kumoh National Institute of Technology)
  • 이상재 (금오공과대학교 전자공학부) ;
  • 최주란 (금오공과대학교 대학원 지능기계공학과) ;
  • 최성대 (금오공과대학교 지능기계공학과)
  • Received : 2015.02.01
  • Accepted : 2015.02.25
  • Published : 2015.02.28
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Abstract

The design of the glass-carrier was studied using simulations of the temperature distribution of an ITO deposition inline-sputter process. The temperature distribution was simulated in Heating Chamber 7, and in the ITO Deposition Chambers 8 and 9. The temperature distribution of the glass sheets was low in both the lower and upper lines. Moreover, it was observed that the temperature in Chamber 8 significantly affected the temperature in Chamber 9, and that the latter was hotter. The rear of the chambers were subjected to more heating than the fronts, so the temperature range at the back was wider. Redesigning the shape of the carrier made it possible to load more glass sheets on the glass carrier, and to make deposits on the ITO glass at higher temperature, over a wider area.

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References

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