References
- Semiconductor Industry Association (SIA), International Technology Roadmap for Semiconductors (ITRS), 2010.
- D. Gizopoulos, Advances in Electronic Testing, Springer, 2006, ISBN 0-387-29409-0.
- M. Banga, N. Rahagude, and M.S. Hsiao, "Design-for-Test Methodology for Non-Scan at-Speed Testing," Proc. Conf. DATE, Grenoble, France, Mar. 14-18, 2011, pp. 1-6.
- M. Kume et al., "Programmable at-Speed Array and Functional BIST for Embedded DRAM LSI," Proc. Int. Test Conf., Charlotte, NC, USA, Oct. 26-28, 2004.
- R.D. Adams et al., "An Integrated Memory Self Test and EDA Solution," Proc. IEEE Int. Workshop Memory, Technol., Des., Test, San Jose, CA, USA, Aug. 9-10, 2004, pp. 92-95.
- C.-W. Lin et al., "Fault Models and Test Methods for Subthreshold SRAMs," IEEE Int. Test Conf., Ausin, TX, USA, Nov. 2-4, 2010, pp. 1-10.
- M. Kassab et al., "Dynamic Channel Allocation for Higher EDT Compression in SoC Designs," IEEE Int. Test Conf., Ausin, TX, USA, Nov. 2-4, 2010, pp. 1-10.
- J. Rajski et al., "Embedded Deterministic Test," IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., vol. 23, no. 5, May 2004, pp. 776-792. https://doi.org/10.1109/TCAD.2004.826558
- H. Tang, S.M. Reddy, and I. Pomeranz, "On Reducing Test Data Volume and Test Application Time for Multiple Scan Chain Designs," Proc. Int. Test Conf., Charlotte, NC, USA, Sept. 28 - Oct. 3, 2003, pp. 1079-1088.
- S. Mitra and K.S. Kim, "X-Compact: An Efficient Response Compaction Technique for Test Cost Reduction," Proc. Int. Test Conf., Baltimore, MD, USA, Oct. 7-10, 2002, pp. 311-320.
- A. Chandra and K. Chakrabarty, "Test Data Compression for System-on-a-Chip Using Golomb Codes," Proc. IEEE VLSI Test Symp., 2000, pp. 113-120.
- S.E. Oakland, "Combining IEEE Standard 1149.1 with Reduced-Pin-Count Component Test," Proc. VLSI Test Symp., Atlantic City, NJ, USA, Apr. 15-17, 1991, pp. 78-84.
- A.H. Baba and K.S. Kim, "Framework for Massively Parallel Testing at Wafer and Package Test," Proc. IEEE Int. Conf. Comput. Des., Lake Tahoe, CA, USA, Oct. 4-7, 2009, pp. 328-334.
- S.K. Goel and E.J. Marinissen, "On-Chip Test Infrastructure Design for Optimal Multi-site Testing of System Chips," Proc. Conf. DATE, Munich, Germany, Mar. 7-11, 2005, pp. 44-49.
- S.K. Goel and E.J. Marinissen, "Optimisation of on-Chip Designfor-Test Infrastructure for Maximal Multi-site Test Throughput," IEE Proc. Comput., Digital Techn., vol. 152, no. 3, May 2005, pp. 442-456. https://doi.org/10.1049/ip-cdt:20050046
- E.H. Volkerink et al., "Test Economics for Multi-site Test with Modern Cost Reduction Techniques," Proc. IEEE VLSI Test Symp., 2002, pp. 411-416.
- J.-F. Li et al., "A Hierarchical Test Methodology for Systems on Chip," IEEE Micro, vol. 22, no. 5, 2002, pp. 69-81. https://doi.org/10.1109/MM.2002.1044301
- J. Jahangiri et al., "Achieving High Test Quality with Reduced Pin Count Testing," Proc. Asian Test Symp., Kolkata, India, Dec. 18-21, 2005, pp. 312-317.
- IEEE Computer Society Test Technology Technical Committee, "IEEE Standard Test Access Port and Boundary-Scan Architecture," IEEE Standard 1149.1, Institute of Electrical and Electronics Engineers, Inc., New York, Jan. 1990.
- IEEE Computer Society, IEEE Standard Testability Method for Embedded Core-Based Integrated Circuits, Aug. 29, 2005.
- D.-K. Han, Y. Lee, and S.-H. Kang, "Novel Hierarchical Test Architecture for SoC Test Methodology Using IEEE Test Standards," J. Semicond. Technol., Science, vol. 12, no. 3, Sept. 2012, pp. 293-296. https://doi.org/10.5573/JSTS.2012.12.3.293