Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Palladium-Nickel Alloy Electrodeposition Using Ethylenediamine as Complexing Agent

에틸렌디아민을 착화제로 사용하는 팔라듐-니켈 합금도금

  • Choi, Byungha (Department of Materials Science and Metallurgy, Kyungpook National University) ;
  • Sohn, Ho-Sang (Department of Materials Science and Metallurgy, Kyungpook National University) ;
  • Kim, Kyung Tae (Powder & Ceramic Materials Division, Korea Institute of Materials Science) ;
  • Son, Injoon (Department of Materials Science and Metallurgy, Kyungpook National University)
  • 최병하 (경북대학교 신소재공학부 금속신소재공학전공) ;
  • 손호상 (경북대학교 신소재공학부 금속신소재공학전공) ;
  • 김경태 (재료연구소 분말기술연구실) ;
  • 손인준 (경북대학교 신소재공학부 금속신소재공학전공)
  • Received : 2014.10.20
  • Accepted : 2014.10.28
  • Published : 2014.10.31
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Abstract

Electrodeposition behaviors of Pd-Ni alloys were investigated from the polarization curves in a solution containing ethylenediamine as complexing agent. The microstructure and hardness of electrodeposited Pd-Ni alloys were also characterized. Codeposition of Pd-Ni alloys was successfully performed in the wide current density ranging from 2 to $5000A{\cdot}m^{-2}$ because the deposition potential of Pd became close to that of Ni in the ethylenediamine-contained solution. It was also found from X-ray diffraction patterns that the solid solution between Pd and Ni was formed with variation of the composition of alloys. The measured hardness of Pd-Ni alloys increased with increasing the contents of Ni due to solid solution strengthening and grain refinement. The electrodeposited Pd-Ni alloys also exhibited a crack free smooth surface morphology from the SEM observation.

Keywords

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