참고문헌
- D. Cullen, E. Huenger, M. Toben, B. Houghton and K. Johal, "A study on interfacial fracture phenomenon of solder joints formed using the electroless nickel/immersion gold surfaces finish", Proc. IPC works 2000, s03, (2000).
- Y. C. Sohn and J. Yu, "Correlation between interfacial reaction and brittle fracture found in elecroless Ni(P) metallization", J. Microelectron. Packag. Soc., 12(1), 41 (2005).
- Z. Mei, M. Kauffmann, A. Eslambolchi and P. Jonson, "Brittle interfacial fracture of PBGA packages on electroless Ni/ immersion Au", Proc. 48th Electronics Component and Technology Conference, 952 (1998).
- G.M. Wenger, R. J. Coyle, P. P. Solan, J. K. Dorey, C. V. Dodde, R. Erich and A. Primavera, "Case studies of brittle interfacial fractures in area array solder intercommnects", Proc. 26th International Symposium for testing and failure analysis, 355 (2000).
- T. I. Eijim, D. B. Hollesen, A. Holliday, S. A. Gahr and R. J. Coyle, "Assembly and reliability of thermally enhanced high I/O BGA packages", Proc. 21th IEEE International Electronics Manufacturing Symposium, 25 (1997).
- J. W. Jang, D. R. Frear, T. Y. Lee and K. N. Tu, "Morpholgy of interfacial reaction between lead-free solders and electroless Ni-P under bump metallization", J. Appl. Phys., 88(11), 6359 (2000). https://doi.org/10.1063/1.1321787
- D. Goyal, T. Lane, P. Kinzie, C. Panichas, K. M. Chong and O. Villalobos, "Failure mechanism of brittle solder joint fracture in the presence of electroless Ni immersion gold (ENIG) interface", Proc. 52nd Electronic Component and Technology Conference, 732 (2002).
- K. Zeng, R. Stierman, D. Abbott and M. Murtuza "The root cause of black pad failure of solder joints with electroless Ni/ immersion gold plating", JOM, 75 (2006).
- D. G. Lee, T. J. Chung, J. W Choi, S. H. Huh, S. J. Cho, Y. J. Yoon and B. Y. Min, "New surface finish of the substrate for the flip chip packaging", SEMICON Korea 2007, 255 (2007).
- Y. D. Jeon, Y. B. Lee, and Y. S. Choi, "Thin electroless Cu/ OSP on electroless Ni as a novel surface finish", 2006 Electronic Components and Technology Conference IEEE, 116 (2006).
- D. G. Lee, T. J. Chung, J. W. Choi, S. H. Huh, S. J. Cho, Y. J. Yoon and B. Y. Min, "New surface finish of the substrate for the flip chip packaging" SEMICON Korea 2007, 255 (2007).
- R. Ramanauskas, A. Selskis, F. Fuodkazyte and V. Fasulaitiene, "PCB failure analysis related to the ENIG black pad problem", Circuit World, 39(3), 124 (2013). https://doi.org/10.1108/CW-05-2013-0013
- K. Suganuma and K. S. Kim, "The root causes of the black pad phenomenon and avoidance tactics", JOM, 60(6), 61 (2008).
- M. O. Alam, "Reliability of BGA solder joints on the Au/Ni/ Cu bond pad-Effect of thickness of Au and Ni layer" IEEE Transaction on Device and Materials Reliability, 6(3), 421 (2006). https://doi.org/10.1109/TDMR.2006.881451
- J. H. Lee, S. H. Huh, G. H. Jung and S. J. Ham, "Effects of the electroless Ni-P thickness and assembly process on solder ball joint reliability", J. KWS., 34(3), 60 (2014).
- A. Kumar and Z. Chen, "Effect of Ni-P thickness on the tensile strength of Cu/Electroless Ni-P/Sn-3.5Ag solder joint", 7th Electronics Packaging Technology Conference, IEEE, 873 (2005).
- K. Pun, P. L. Eu, M. N. Islam and C. Q. Cui, "Effect of Ni layer thickness on intermetallic formation and mechanical strength of Sn-Ag-Cu solder joint", 10th Electronics Packaging Technology Conference, IEEE, 487 (2008).
- S. H. Huh, K. D. Kim and K. S. Kim, "A novel high speed shear test for lead free flip chip package, Electron". Mater. Lett., 8(1), 53 (2012). https://doi.org/10.1007/s13391-011-0510-3
- W. L. Liu, S. H. Hsieh and W. J. Chen, "Growth behavior of Ni-P film on Fe/Si substrate in an acid electroless plating bath", Electrochem. Soc., 155(3), D192 (2008). https://doi.org/10.1149/1.2826229
- D. K. Lee, D. G. Kim and B. Y. Yoo, "Influence of doping on Ni electroless deposition at single crystalline Si", Electrochem. Soc., 158(8), D490 (2011). https://doi.org/10.1149/1.3597157
- J. W. Yoon, J. W. Kim, J. M. Koo, S. S. Ha, B. I. Noh, W. C. Moon, J. H. Moon and S. B. Jung, "Flip-chip bonding technology and reliability of electronic packaging", J. KWS, 25, 6 (2007).
- S. S. Ha, J. W. Kim, J. H. Chae, W. C. Moon, T. H. Hong, C. S. Yoo, J. H. Moon and S. B. Jung, "Thermo-mechanical reliability of lead-free surface mount assemblies for automobile application", J. KWS., 24, 21 (2006).
- I. Platzman, R. Brener, H. Haick and R. Tannenbaum, "Oxidation of Polycrystalline copper thin films at ambient conditions", J. Phys. Chem. C., 112, 1101 (2008). https://doi.org/10.1021/jp076981k
- D. Tian, D. Y. Li, F. F. Wang, N. Xiao, R. Q. Lia, N. Li, Q. Li, W. Gao and G. Wu, "A Pd-free activation method for electroless nickel deposition on copper", Surf. Coat. Techol., 228, 27 (2013). https://doi.org/10.1016/j.surfcoat.2013.03.048
- P. H. Lo, W. T. Tsai, J. T. Lee and M. P. Hung, "The electrochemical behavior of electroless plated Ni-P alloy in concentrated NaOH solution", Electrochem. Soc., 142(1), 91 (1995). https://doi.org/10.1149/1.2043954