Study of ablation depth control of ITO thin film using a beam shaped femtosecond laser

빔 쉐이핑을 이용한 펨토초 레이저 ITO 박막 가공 깊이 제어에 대한 연구

  • 김훈영 (한국기계연구원 나노공정연구실) ;
  • 윤지욱 (한국기계연구원 나노공정연구실) ;
  • 최원석 (한국기계연구원 나노공정연구실) ;
  • ;
  • 황경현 (한국기계연구원 나노공정연구실) ;
  • 조성학 (한국기계연구원 나노공정연구실)
  • Received : 2014.02.25
  • Accepted : 2014.03.27
  • Published : 2014.03.31

Abstract

Indium tin oxide (ITO) is an important transparent conducting oxide (TCO). ITO films have been widely used as transparent electrodes in optoelectronic devices such as organic light-emitting devices (OLED) because of their high electrical conductivity and high transmission in the visible wavelength. Finding ways to control ITO micromachining depth is important role in the fabrication and assembly of display field. This study presented the depth control of ITO patterns on glass substrate using a femtosecond laser and slit. In the proposed approach, a gaussian beam was transformed into a quasi-flat top beam by slit. In addition, pattern of square type shaped by slit were fabricated on the surfaces of ITO films using femtosecond laser pulse irradiation, under 1030nm, single pulse. Using femtosecond laser and slit, we selectively controlled forming depth and removed the ITO thin films with thickness 145nm on glass substrates. In particular, we studied the effect of pulse number on the ablation of ITO. Clean removal of the ITO layer was observed when the 6 pulse number at $2.8TW/cm^2$. Furthermore, the morphologies and fabricated depth were characterized using a optical microscope, atomic force microscope (AFM), and energy dispersive X-ray spectroscopy (EDS).

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