Abstract
In this paper, Thermal Shock tests were performed varying the composition of the solder and ribbon thickness (A-type:0.2mm/60Sn40Pb, B-type:0.25mm/60Sn40Pb, C-type:0.2 /62Sn36Ag2Pb, D-type:0.25mm/62Sn36Ag2Pb) for evaluating the long-term reliability about Ribbon junction of Silicon solar cells. Thermal Shock test condition was performed during the 600cycles having $-40^{\circ}C{\sim}85^{\circ}C$ temperature range each 15 minutes; One cycle time was 30min. As a result, the initial efficiency of the A-type, B-type, and C, D-type were showed 15.0%, 15.4% and 15.8% respectively. After thermal shock test, the efficiency decreasing-rate of each type were as follow that A-type was 13.8%, B-Type was 15.4%. C-Type and D-Type was 15.3% and 16.2%, respectively. Also, degradation of surface changes and I-V characteristic curves were showed that the series resistance of the A, C-type was increased. Also, current lowering starting point of C-type shown 0.05volt[v] earlier than that of A-type. And B, D-type shown characteristics of composite lowering efficiency such as increase of series resistance, decrease of parallel resistance and cell damage. Therefore Initial solderability and efficiency of specimens using the solder with SnAgPb were superior. But, It has inferior the long-term reliability. The test was confirmed that as the ribbon thickness increases, long-term reliability of solar cell will decrease.
본 논문에서는 실리콘 태양전지의 Ribbon 접합부에 대한 장기 신뢰성 평가를 위해 Ribbon 두께와 솔더 조성을 달리하여 (A-type:0.2mm/SnPb, B-type:0.25mm/SnPb, C-type:0.2/SnA gPb, D-type:0.25mm/SnAgPb) 열충격 시험을 수행하였다. 열충격 시험 조건은 $-40^{\circ}C$에서 $85^{\circ}C$로 각각 15분씩 30분을 1 cycle로 하여 600 cycle을 수행하였다. 그 결과 초기효율은 A-type이 15.0%, B-type이 15.4% 및 C, D-type이 15.8%를 나타냈으며, 열충격 시험 후 초기효율 대비 효율감소율은 A-Type이 13.8%, B- Type이 15.4%, C-Type이 15.3% 및 D-Type이 16.2%을 나타냈다. I-V 특성곡선 및 표면변화를 비교한 결과, 표면의 변화는 큰 차이가 없었으나, A, C-Type의 시편에서는 직렬저항이 증가하였고, C-Type의 I-V 특성곡선 Current 저하 시작점이 A-Type보다 0.05(V)빠르게 나타났다. B, D-Type에서는 직렬저항 증가 및 병렬저항 감소의 복합적인 효율 저하 특성이 나타났으며, Cell 손상도 확인할 수 있었다. SnAgPb계열 솔더를 사용한 시편이 초기 접합성 및 효율 측면에서 우수하였으나, 장기신뢰성에서 취약하였으며, Ribbon 두께가 두꺼울수록 장기신뢰성이 저하되는 것을 확인 할 수 있었다.
