반도체금형에서 부속부품의 재료선정 및 개선과 제작에 관한 연구

A study on material selection for semiconductor die parts and on their modification and manufacture

Alloy tool steel such as SKD11 and SKD61 or high speed tool like SKH51 are used as materials for semiconductor dies. Cavities, curl blocks, pot blocks and housings are made from those materials. To make those parts from alloy tool steel or high speed tool, one utilizes discharge machining, and mechanical machining including machining center, milling, drilling, forming grinding and others. In the process of cutting machining and polishing, the die materials become unsuitable for machining owing to bubbles and foreign substances in them, which hinders production process. Therefore, this study focuses on die material selection criteria, and on analysis and comparison of material characteristics to help companies to solve their problems, make die manufacture less burdensome and extend die life.