Transactions of the Korean Society of Automotive Engineers (한국자동차공학회논문집)

The Korean Society of Automotive Engineers (한국자동차공학회)
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Strength Evaluation of Pb-free Solder Joints with Artificial Aging Time and Test Temperature

Pb-free 솔더 조인트의 인공시효 처리시간과 실험온도에 따른 강도평가

  • Park, Soyoung (Department of Mechanical System Engineering, Chonbuk National University) ;
  • Yang, Sungmo (Department of Mechanical System Engineering, Chonbuk National University) ;
  • Yu, Hyosun (Department of Mechanical System Engineering, Chonbuk National University)
  • 박소영 (전북대학교 기계시스템공학과) ;
  • 양성모 (전북대학교 기계시스템공학과) ;
  • 유효선 (전북대학교 기계시스템공학과)
  • Received : 2013.10.31
  • Accepted : 2014.03.04
  • Published : 2014.04.01
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Abstract

The conventional SnPb solders were widely used for several decades in the electronic packing system due to the superior mechanical properties such as low melting point, better wettavility and good mechanical fatigue. However, in recent years, owing to adverse effect on the human health and environment, conventional SnPb solders have been replaced by Lead-free solders. In this research, the shear punch(SP) test of Sn-4Ag-(Cu)/Ni pad was performed. Pb-free solder alloys which are the environmentally friendly of the electronic components were performed at $150^{\circ}C$ for 100hr~1000hr to artificial aging processing. In order to evaluate the mechanical properties of solder joints, the SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of almost the whole specimens was decreased with the increase in aging time and temperature of SP test. The mechanical properties of Sn-4Ag-0.5Cu solder were most excellent in all Pb-free solder which were produced by the SP test at $30^{\circ}C$.

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References

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