Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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Glass Drilling using Laser-induced Backside Wet Etching with Ultrasonic Vibration

초음파 진동과 레이저 후면 에칭을 통한 유리 구멍 가공

  • Kim, Hye Mi (Department of Mechanical System Design Eng., Seoul National Univ. of Science & Technology) ;
  • Park, Min Soo (Department of Mechanical System Design Eng., Seoul National Univ. of Science & Technology)
  • 김혜미 (서울과학기술대학교 기계시스템디자인공학과) ;
  • 박민수 (서울과학기술대학교 기계시스템디자인공학과)
  • Received : 2013.07.16
  • Accepted : 2013.12.04
  • Published : 2014.01.01
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Abstract

Laser beam machining has been known as efficient for glass micromachining. It is usually used the ultra-short pulsed laser which is time-consuming and uneconomic process. In order to use economic and powerful long pulsed laser, indirect processing called laser-induced backside wet etching (LIBWE) is good alternative method. In this paper, micromachining of glass using Nd:YAG laser with nanosecond pulsed beam has been attempted. In order to improve shape accuracy, combined processing with magnetic stirrer has been widely used. Magnetic stirrer acts to circulate the solution and remove the bubble but it is not suitable for deep hole machining. To get better effect, ultrasonic vibration was applied for improving shape accuracy.

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References

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  1. Fabrication of Glass Microstructure Using Laser-Induced Backside Wet Etching vol.38, pp.9, 2014, https://doi.org/10.3795/KSME-A.2014.38.9.967