• 한국정밀공학회지
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• 제31권1호
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• pp.75-81
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• 2014

Laser beam machining has been known as efficient for glass micromachining. It is usually used the ultra-short pulsed laser which is time-consuming and uneconomic process. In order to use economic and powerful long pulsed laser, indirect processing called laser-induced backside wet etching (LIBWE) is good alternative method. In this paper, micromachining of glass using Nd:YAG laser with nanosecond pulsed beam has been attempted. In order to improve shape accuracy, combined processing with magnetic stirrer has been widely used. Magnetic stirrer acts to circulate the solution and remove the bubble but it is not suitable for deep hole machining. To get better effect, ultrasonic vibration was applied for improving shape accuracy.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.353-354
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• 2012

• 한국레이저가공학회지
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• 제18권3호
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• pp.9-13
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• 2015

The development of a reliable, high-power source of mind-IR laser light gives process develop important tool with unique characteristics that will significantly impact a diverse range of applications.

• 한국기계가공학회지
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• 제11권5호
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• pp.99-103
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• 2012

Presently, A glass is widely used in telecommunication system, optoelectronic devices and micro electro mechanical systems. Micro drilling of glass using the laser can save processing cost and improve the accuracy. This paper experiments micro drilling using KrF excimer laser on the pyrex glass of $500{\mu}m$ thickness. We have experiment to find out optimum laser machining conditions of micro drilling of glass and ablation depth and influence by processing parameter suc'h pulse repetition rate, energy density and number of pulses. Pulse repetition rate don't influence ablation depth at the micro drilling of pyrex glass. Energy density influence micro drilling of parallelism and maximum thickness that can be drilled. Ablation depth is most influenced by number of pulses.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.1052-1055
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• 2001

In micro-drilling of brittle materials including glass, cracks occur at the exit surface. In drilling glass, the main type of crack is cone crack. Cone crack is generated by thrust force acting at the bottom surface of the workpiece. Cone crack size could be reduced by changing cutting conditions, but cone crack still existed. Two methods were proposed to prevent crack formation and perfect hole shapes were obtained. One method is attaching two glass plates with water and the other method is constraining two glass plates. The proposed methods eliminated tensile stress acting on the exit surface of glass and prevented crack propagation.

• 대한기계학회논문집A
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• 제37권2호
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• pp.213-218
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• 2013

초음파 가공(Ultrasonic Machining:USM)은 새로운 기계가공기술 분야 중의 하나이다. 초음파 가공 과정은 비열, 비화학, 그리고 비전도의 방법이기 때문에 공작물 재료의 물리적, 화학적 변화가 없다. 이러한 특성으로 인해 초음파 가공기술은 유리, 세라믹 등과 같은 취성재료의 가공에 적합하다. 그러나 단점으로는 초음파 진동을 이용하여 취성재료를 가공하는 경우 크랙이 빈번하게 발생한다. 본 논문에서는 유리와 세라믹의 미세 구멍가공에서 다구찌 방법을 이용하여 크랙발생을 최소화하는 최적의 가공조건을 얻고자 하였다. 이를 통해 공작물의 입구 및 출구에서 발생하는 크랙 현상을 감소시켰다.

• Composites Research
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• 제23권6호
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• pp.55-60
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• 2010

본 연구에서는 열가소성 복합재료인 유리섬유/폴리프로필렌 복합재료를 이용한 복합재료 고정판의 적절한 성형조건을 찾기 위해 다양한 성형조건으로 제작된 시편의 인장실험과 굽힘실험을 수행하여 성형조건에 따른 기계적 거동을 비교하였다. 실험 결과 성형온도와 압력이 각각 $230^{\circ}C$, 3MPa일 때 가장 우수한 기계적 특성을 가짐을 확인하였다. 성형실험을 통해 결정된 성형조건을 이용한 복합재료 고정판의 성형방법으로는 고정판의 스크류 구멍을 한번에 성형하는 정형성형방법과 스크류 구멍을 후가공하는 방법을 사용하였으며, 성형실험과 굽힘실험 결과 스크류 구멍을 후가공 하는 경우 우수한 굽힘특성을 가지는 것을 확인하였다. 본 논문에서는 복합재료 고정판의 적절한 성형을 위해 유리섬유/폴리프로필렌 복합재료의 기초 성형정보와 그에 따른 고정판 성형에 대한 연구를 수행하였으며, 이 결과는 해당재료를 이용한 구조물 성형에 중요한 정보를 제공할 것으로 기대된다.

• 센서학회지
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• 제13권1호
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• pp.72-77
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• 2004

In this paper, we fabricated an apparatus of the electro-chemical discharge drilling for boring narrow through-hole into a glass. In the electrolyte, electro-chemical discharge creates high temperature condition by the electro-discharge energy. Therefore, glass are removed by the accelerated chemical reaction with glasses and chemicals in the high temperature condition. For optimization of the electro-chemical discharge drilling, the process condition was studied experimentally as a function of the electrolyte concentration, supply voltage and process time. The optimum condition was from DC25V to DC30V of applied voltage, 35 wt% NaOH solution.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 센서 박막재료 반도체재료 기술교육
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• pp.12-15
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• 2002

In this paper, we fabricated a electro-chemical discharge machine for drilling microscopic glass hole. In this research, we used a glass plate and NaOH solution. From the experimental result, we knew that the change of voltage wave was caused by drilling microscopic hole of glass using electro-chemical discharge method. So, we can give a function of the power auto stop to electro-chemical discharge machine with the change of voltage wave.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 추계학술대회 논문집 전기물성,응용부문
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• pp.297-299
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• 2003

In this paper, we present the fabrication of copper electrode array and test of electrochemical discharge machining for the fabrication of microholes on Borofloat33 glass. Copper electrode array is fabricated by the bonding of silicon upper substrate and lower substrate and copper electroplate. The silicon upper electrode having microholes fabricated by ICP-RIE is the mold of copper electroplate. The lower substrate is used as the seed layer for copper electroplate after Au - Au thermocompression bonding with the upper substrate.