DOI QR코드

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실리콘 웨이퍼 휨형상 측정 정밀도 향상을 위한 시스템변수 보정법

System calibration method for Silicon wafer warpage measurement

  • 김병창 (경남대학교 기계공학부)
  • 투고 : 2014.11.06
  • 심사 : 2014.12.31
  • 발행 : 2014.12.31

초록

As a result of a mismatch of the residual stress between both sides of the silicon wafer, which warps and distorts during the patterning process. The accuracy of the warpage measurement is related to the calibration. A CCD camera was used for the calibration. Performing optimization of the error function constructed with phase values measured at each pixel on the CCD camera, the coordinates of each light source can be precisely determined. Measurement results after calibration was performed to determine the warpage of the silicon wafer demonstrate that the maximum discrepancy is $5.6{\mu}m$ with a standard deviation of $1.5{\mu}m$ in comparison with the test results obtained by using a Form TalySurf instrument.

키워드

참고문헌

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피인용 문헌

  1. Hybrid 인터커넥션 구현을 위한 광전 복합케이블 제작에 관한 연구 vol.16, pp.3, 2014, https://doi.org/10.14775/ksmpe.2017.16.3.138