마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제21권4호
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  • Pages.51-56
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  • 2014
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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Ag 코팅 Cu 플레이크 필러를 사용한 도전 페이스트의 전기 및 열전도도

Electrical Resistivity and Thermal Conductivity of Paste Containing Ag-coated Cu Flake Filler

  • 투고 : 2014.12.05
  • 심사 : 2014.12.22
  • 발행 : 2014.12.30
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초록

가격적 경쟁력을 가지는 Ag 코팅 Cu 플레이크 함유 도전성 페이스트를 제조하여 경화조건에 따른 열전도도 및 전기전도도 값의 변화를 측정하였다. 대기 중에서 경화시킨 시편의 경우 경화시간이 30분에서 60분으로 증가됨에 따라 열전도도가 증가하는 경향이 관찰되었다. 60분의 동일한 경화시간 조건에서는 질소 중 경화 시편이 대기 중 경화 시편보다 향상된 열전도도 값을 나타내었다. 그 결과 질소 중에서 60분간 경화시킨 Ag 코팅 Cu 플레이크 페이스트는 순수 Ag 플레이크가 함유된 페이스트가 나타내는 열전도도에 근접하는 열특성을 나타내었다. 한편 대기 중 경화 시편의 경우 경화시간이 30분에서 60분으로 증가됨에 따라 비저항 값이 더욱 증가하는 경향이 관찰되었나, 60분의 동일한 경화시간 조건에서 질소 중 경화 시편은 대기 중 경화 시편에 비할 수 없을 만큼 개선된 비저항 값($7.59{\times}10^{-5}{\Omega}{\cdot}cm$)을 나타내었다.

After the preparation of low-cost conductive paste containing Ag-coated Cu flakes, thermal conductivity and electrical resistivity of the paste were measured with different curing conditions. Under air-curing conditions, the thermal conductivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, the sample cured under nitrogen indicated more enhanced thermal conductivity than that cured under air, approaching that of paste containing pure Ag flakes. Under air-curing conditions, meanwhile, the electrical resistivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, however, the sample cured under nitrogen indicated extremely enhanced electrical resistivity ($7.59{\times}10^{-5}{\Omega}{\cdot}cm$) in comparison with that cured under air.

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