ETRI Journal

  • 제35권6호
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  • Pages.1152-1155
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  • 2013
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  • 1225-6463(pISSN)
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  • 2233-7326(eISSN)
한국전자통신연구원 (Electronics and Telecommunications Research Institute)
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Fine-Pitch Solder on Pad Process for Microbump Interconnection

  • 투고 : 2013.06.15
  • 심사 : 2013.08.21
  • 발행 : 2013.12.31
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초록

A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

키워드

참고문헌

  1. A. Yu et al., "Fabrication of High Aspect Ratio TSV and Assembly with Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology with High-Density Interconnects," IEEE Trans. Comp. Packag. Manufact. Technol., vol. 1, no. 9, Sept. 2011, pp. 1336-1344. https://doi.org/10.1109/TCPMT.2011.2155655
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  11. J.-W. Baek et al., "Chemo-rheological Characteristic of a Self- Assembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder," Microelectron. Eng., vol. 87, 2010, pp. 1968-1972. https://doi.org/10.1016/j.mee.2009.12.020
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  13. Y.-S. Eom et al., "Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder," ETRI J., vol. 32, no. 3, June 2010, pp. 414-421. https://doi.org/10.4218/etrij.10.0109.0400

피인용 문헌

  1. Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications vol.4, pp.10, 2013, https://doi.org/10.1109/tcpmt.2014.2354049
  2. HV-SoP Technology for Maskless Fine-Pitch Bumping Process vol.37, pp.3, 2013, https://doi.org/10.4218/etrij.15.0114.0578
  3. Interconnection Technology Based on InSn Solder for Flexible Display Applications vol.37, pp.2, 2013, https://doi.org/10.4218/etrij.15.0114.0167
  4. Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding vol.38, pp.6, 2013, https://doi.org/10.4218/etrij.16.0115.0945
  5. Characterization of transmission lines with through-silicon-vias and bump joints on high-resistivity Si interposers for RF three-dimensional modules vol.55, pp.6, 2016, https://doi.org/10.7567/jjap.55.06jc01
  6. Study the Electrical Properties of Surface Mount Device Integrated Silver Coated Vectran Yarn vol.15, pp.1, 2013, https://doi.org/10.3390/ma15010272