Journal of Sensor Science and Technology (센서학회지)

The Korean Sensors Society (한국센서학회)
권호 표지
DOI QR코드

DOI QR Code

Elastic Buffer Layer Coupled Micro Probe

탄성 버퍼층 결합형 마이크로 프로브

  • Choi, Ju Chan (Graduate School of Electronics Engineering, Kyungpook National University) ;
  • Choi, Young Chan (Graduate School of Electronics Engineering, Kyungpook National University) ;
  • Jung, Dong Geon (Graduate School of Electronics Engineering, Kyungpook National University) ;
  • Kong, Seong Ho (Graduate School of Electronics Engineering, Kyungpook National University)
  • 최주찬 (경북대학교 대학원 전자공학부) ;
  • 최영찬 (경북대학교 대학원 전자공학부) ;
  • 정동건 (경북대학교 대학원 전자공학부) ;
  • 공성호 (경북대학교 대학원 전자공학부)
  • Received : 2013.08.26
  • Accepted : 2013.09.15
  • Published : 2013.09.30
Download PDF
⟨ Previous Next ⟩

Abstract

In this paper, a new structure of probe unit is designed and fabricated with PDMS, which is well-known elastic material, as a buffer layer for increasing overdrive force and mechanical strength. In general, PDMS is widely used as actuation material due to its elasticity and compatibility of fabrication process. In this work, PDMS layer is chosen for mechanical elasticity of the proposed probe unit. We achieved the high overdrive force by placing PDMS buffer layer under the silicon based cantilever due to its elasticity. Moreover, the relation between prove length and overdrive force was measured by experiment in this work. Therefore, the various specifications of the micro prove unit can be designed by using the results of this work.

Keywords

References

  1. P. H. Hong, D. Y. Kong, D. I. Lee, B. Kim, C. S. Cho, and J. H. Lee, "Fabrication of probe beam by using joule heating and fusing", J. Sensor Sci. & Tech., Vol. 22, No. 1, pp. 89-94, 2013. https://doi.org/10.5369/JSST.2013.22.1.89
  2. T. Itoh, K. Kataoka, and T. Suga, "Characteristics of low force contact process for MEMS probe cards", Sens. Actuator A-Phys., Vol. 97-98, pp. 462-467, 2002. https://doi.org/10.1016/S0924-4247(01)00822-6
  3. T. Itoh, S. Kawamura, K. Kataoka, and T. Suga, "Electroplated Ni microcantilever probe with electrostatic actuation", Sens. Actuator A-Phys., Vol. 123-124, pp. 490-496, 2005. https://doi.org/10.1016/j.sna.2005.03.023
  4. Y. Zhang, Y. Zhang, and R. B. Marcus, "Thermally actuated microprobes for a new wafer probe card", IEEE J. Microelectromech. Syst., Vol. 8, No. 1, pp. 43-49, 1999. https://doi.org/10.1109/84.749401
  5. F. Wang, R. Cheng, and X. Li, "MEMS vertical probe cards with ultra densely arrayed metal probes for wafer-level IC testing", IEEE J. Microelectromech. Syst., Vol. 18, No. 4, pp. 933-941, 2009. https://doi.org/10.1109/JMEMS.2009.2021815
  6. C. J. Kim, H. Jung, J. C. Yang, S. H. Kong, D. S. Jang, and C. Kim, "Fabrication of a MEMS-based fine-pitch cantilever-type probe unit", Proc. of IEEE Conf. on Sensors, pp. 530-533, Daegu, Republic of Korea, 2006.
  7. J. C. Yang, H. Jung, C. J. Kim, J. E. Kim, and S. H. Kong, "Fabrication of a MEMS-based fine-pitch cnatilever-type probe unit", Proc. Intern. Microprocesses and Nanotechnology Conf., pp. 328-329, Kamakura, Japen, 2006.
  8. S. H. Yoon, V. R. Ortiz, K. H. Kim, Y. H. Seo, and M. R. K. Mofrad, "Analysis of circular PDMS microballoons with ultralarge deflection for MEMS design", J. Microelectromech. Syst., Vol. 19, No. 4, pp. 854-864, 2010. https://doi.org/10.1109/JMEMS.2010.2049984
  9. O. C. Jeong and S. Konishi, "All PDMS pneumatic microfinger with bidirectional motion and its application", J. Microelectromech. Syst., Vol. 15, No. 4, pp. 896-903, 2006. https://doi.org/10.1109/JMEMS.2006.879377
  10. A. S. Nezhad, M. Ghanbari, C. G. Agudelo, M. Packirisamy, R. B. Bhat, and A. Geitmann, "PDMS microcantilever-based flow sensor integration for lab-on-a-chip", IEEE Sens. J., Vol. 13, No. 2, pp. 601-609, 2013. https://doi.org/10.1109/JSEN.2012.2223667