Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Effect of Electroplating Parameters on Electrodeposits of Invar Alloy

인바합금 도금층의 물성에 영향을 미치는 도금인자에 관한 연구

  • Kim, Ju-Hwan (Dept. of Materials Science and Engineering, Hongik University) ;
  • Jung, Myung-Won (Dept. of Materials Science and Engineering, Hongik University) ;
  • Yim, TaiHong (Div. of Production Technology, Korea institute of Industrial Technology) ;
  • Lee, Jae-Ho (Dept. of Materials Science and Engineering, Hongik University)
  • 김주환 (홍익대학교 신소재공학과) ;
  • 정명원 (홍익대학교 신소재공학과) ;
  • 임태홍 (한국생산기술연구원 생산기반기술본부) ;
  • 이재호 (홍익대학교 신소재공학과)
  • Received : 2013.03.19
  • Accepted : 2013.03.27
  • Published : 2013.03.30
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Abstract

The experiments were carried out in the variation of current density, pH, temperature, and duty cycle to investigate the influence of electroplating parameters on the properties of Ni-Fe invar alloys. When the current density and temperature were changed, the composition of invar alloy was varied, however, duty cycle and pH hardly affected on the composition of electrodeposited alloys. However, as the duty cycle was increased, microstructure was changed and the decrease of hardness was also observed.

전기도금법을 이용한 인바합금의 전착시도금층의물성에 외부 작동변수가 미치는 영향을 알아보기 위해 전류밀도, duty cycle, pH, 온도를 변화시켜 도금을실시 한 후 도금층의 조성 변화 등을 분석하였다. 전류밀도와 온도의 변화에 따라 도금층의 조성이 변하였지만 duty cycle, pH, 온도의 변화는 도금층의 조성변화에 거의 영향을 미치지 않는다. 하지만 duty cycle 증가 시에는도금층의 미세구조가 변화하고 경도가 감소하는 경향이 관찰되었다.

Keywords

References

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