Transactions on Electrical and Electronic Materials

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
권호 표지
DOI QR코드

DOI QR Code

A Novel Stiff Membrane Seesaw Type RF Microelectromechanical System DC Contact Switch on Quartz Substrate

  • Khaira, Navjot K. (Department of Electronics & Communication Engineering, Lovely Professional University) ;
  • Singh, Tejinder (Department of Electronics & Communication Engineering, Lovely Professional University) ;
  • Sengar, Jitendra S. (Department of Electronics & Communication Engineering, Lovely Professional University)
  • Received : 2013.03.28
  • Accepted : 2013.04.02
  • Published : 2013.06.25
Download PDF
⟨ Previous Next ⟩

Abstract

This paper proposes a novel RF MEMS dc-contact switch with stiff membrane on a quartz substrate. The uniqueness of this work lies in the utilization of a seesaw mechanism to restore the movable part to its rest position. The switching action is done by using separate pull-down and pull-up electrodes, and hence operation of the switch does not rely on the elastic recovery force of the membrane. One of the main problems faced by electrostatically actuated MEMS switches is the high operational voltages, which results from bending of the membrane, due to internal stress gradient. This is resolved by using a stiff and thick membrane. This membrane consists of flexible meanders, for easy movement between the two states. The device operates with an actuation voltage of 6.43 V, an insertion loss of -0.047 dB and isolation of -51.82 dB at 2 GHz.

Keywords

References

  1. J. B. Muldavin and G. M. Rebeiz, Microwave Theory and Techniques, IEEE Trans. on. 48, 1053 (2000) [DOI: http://dx.doi.org/10.1109/22.904744].
  2. Z. J. Yao, S. Chen, S. Eshelman, D. Denniston and C. L. Goldsmith, Microelectromech. Systems, IEEE J. 8, 129 (1999) [DOI:http://dx.doi.org/10.1109/84.767108].
  3. S. P. Pacheco, L. P. B. Katehi and C. T. Nguyen, Microwave Symposium Digest. 2000 IEEE MTT-S International (USA) (Radiat. Lab., Michigan Univ., Ann Arbor, MI, USA 2000 Jun 11-16) p. 165 [DOI: http://dx.doi.org/10.1109/MWSYM.2000.860921].
  4. M. Ruan, J. Shen and C. B. Wheeler, Micro Electro Mechanical Systems, 2001. MEMS 2011. The 14th IEEE International Conference on (USA) (Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA 2001 Jan 21-25) p. 224 [DOI: http://dx.doi.org/10.1109/MEMSYS.2001.906519].
  5. H. C. Lee, J. H. Park, J. Y. Park, H. J. Nam and J. U. Bu, Journal of Micromechanics and Microengineering. 15, 2098 (2005) [DOI:http://dx.doi.org/10.1088/0960-1317/15/11/015].
  6. M. Daneshmand, S. Fauladi, R. R. Mansour, M. Lisi and T. Stajcer, Microwave Symposium Digest, 2009. MTT-S International (USA) (Microwave to Millimeter-wave Lab., Univ. of Alberta, Edmonton, AB, Canada 2009 Jun 07-12) p. 1217 [DOI: http://dx.doi.org/10.1109/MWSYM.2009.5165922].
  7. G. M. Rebeiz, RF MEMS Theory, Design and Technology (John Wiley & Sons, USA, 2003) p. 58.
  8. K. Maninder, K. J. Rangra, D. Rangra and S. Singh, International Journal of Recent Trends in Engineering. 2, 95 (2009).
  9. N. K. Khaira, J. S. Sengar, 2nd International Conference on Biomedical Engineering & Assistive Technologies (India) (Dr. B. R. Ambedkar National Inst. of Tech. Jalandhar, PB, India, 2012 Dec 06-07) p. 706.
  10. J. Kim, S. Kwon, H. Jeong, Y. Hong, S. Lee, I. Song, B. Ju, Sensors and Actuators A: Physical. 153, 114 (2009) [DOI: http://dx.doi.org/10.1016/j.sna.2009.04.002].
  11. J. M. Cabral and A. S. Holmes, Electrotechnical Conference, 2006. MELECON 2006. IEEE Mediterranean (Europe) (Dept. of Ind. Electron., Minho Univ. Malaga, Europe 2006 May 16-19) p. 288 [DOI: http://dx.doi.org/10.1109/MELCON.2006.1653095].
  12. T. Veijola, Equivalent Circuit Models for Micromechanical Inertial Sensors, Ph.D. disertation (Helsinki University of Technology, Espoo, Finland, 1999) p. 16.
  13. L. A. Rocha, E. Cretu and R. F. Wolffenbuttel, Tech. Proc. Of the 2004 NSTI Nanotech. Conference and Trade Show (USA) (Nano Science and Tech. Inst. Boston, MA, USA 2004 Vol. 2) p. 203.
  14. W. M. V. Spenger, R. Puers and I. D. Wolf, J. Adhesion Sci. Technol. 17, 563 (2003) [DOI: http://dx.doi.org/10.1163/15685610360554410].

Cited by

  1. Effective Stress Modeling of Membranes Made of Gold and Aluminum Materials Used in Radio-Frequency Microelectromechanical System Switches vol.14, pp.4, 2013, https://doi.org/10.4313/TEEM.2013.14.4.172
  2. Design Aspects of a New Reliable Torsional Switch with Excellent RF Response vol.17, pp.1, 2016, https://doi.org/10.4313/TEEM.2016.17.1.7