참고문헌
- C. Ryu, J. Lee, H. Lee, K. Lee, T. Oh, and J. Kim, "High frequency electrical model of through wafer via for 3-D stacked chip packaging," in IEEE Proc. Electron. Syst. Integration Technol. Conf., Sep. pp. 215-220, 2006.
- K. J. Han, Madhavan Swaminathan, and T. Bandyopadhyay, "Electromagnetic modeling of Through- Silicon Via (TSV) interconnections using cylindrical modal basis functions", IEEE Transactions on Advanced Packaging, vol. 33, no. 4, pp. 804-817, Nov. 2010. https://doi.org/10.1109/TADVP.2010.2050769
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- J. Kim, J. S. Pak, J. Cho, E. Song, J. Cho, H. Kim, T. Song, J. Lee, H. Lee, K. Park, S. Yang, M. Suh, K. Byun, and J. Kim, "High-frequency scalable electrical model and analysis of a Through Silicon Via (TSV)", IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, no. 2, pp. 181-195, Feb. 2011. https://doi.org/10.1109/TCPMT.2010.2101890
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- J. Cho, M. Kim, J. Kim, J. Pak, H. Lee, J. Lee, K. Park, and J. Kim, "Through-silicon via (TSV) depletion effect", IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), pp. 101-104, 23-26 Oct. 2011.
- J. Cho, E. Song, K. Yoon, J. Pak, J. Kim, W. Lee, T. Song, K. Kim, J. Lee, H. Lee, K. Park, S. Yang, M. Suh, K. Byun, and J. Kim, "Modeling and analysis of Through-Silicon-Via (TSV) moise coupling and suppression using a guard ring", IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 1, no. 2, pp. 220-233, Feb. 2011. https://doi.org/10.1109/TCPMT.2010.2101892
- T. Song, C. Liu, D. Kim, S. Lim, J. Cho, J. Kim, J. Pak, S. Ahn, J. Kim, and K. Yoon, "Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs", Quality Electronic Design (ISQED), 2011 12th International Symposium on, pp. 1,7, 14-16, Mar. 2011.
- J. Cho, "Noise Coupling Analysis and Reduction in 3D-IC considering Through-Silicon Via (TSV) non linearity", Ph.D. Dissertation, KAIST, Daejeon, 2013.
- M. Lee, J. Cho, J. Kim, J. Pak, H. Lee, J. Lee, K. Park, and J. Kim, "Temperature-dependent throughsilicon via (TSV) model and noise coupling", IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), pp. 247- 250, Oct. 2011.
- G. Katti, M. Stucchi, D. Velenis, B. Soree, K. De Meyer, and W. Dehaene, "Temperature-dependent modeling and characterization of through-silicon via capacitance", IEEE Electron Device Letters, vol. 32, no. 4, pp. 563-565, Apr. 2011. https://doi.org/10.1109/LED.2011.2109052
- H. Kim, J. Cho, J. Kim, K. Kim, S. Choi, J. Kim, and J. Pak, "A compact on-interposer passive equalizer for chip-to-chip high-speed data transmission", IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), pp. 95-98, Oct. 2012.
- J. Pak, J. Kim, J. Cho, K. Kim, T. Song, S. Ahn, J. Lee, H. Lee, K. Park, and J. Kim, "PDN impedance modeling and analysis of 3D TSV IC by using proposed P/G TSV array model based on separated P/G TSV and Chip-PDN models", Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 1, no. 2, pp. 208-219, Feb. 2011. https://doi.org/10.1109/TCPMT.2010.2101771
- J. Kim, W. Lee, Y. Shim, J. Shim, K. Kim, J. S. Pak, and J. Kim, "Chip-package hierarchical power distribution network modeling and analysis based on a segmentation method", Advanced Packaging, IEEE Transactions on, vol. 33, no. 3, pp. 647-659, Aug. 2010. https://doi.org/10.1109/TADVP.2010.2043673
- K. Kim, W. Lee, J. Kim, T. Song, J. Kim, J. Pak, H. Lee, Y. Kwon, K. Park, and J. Kim, "Analysis of power distribution network in TSV-based 3DIC", IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), pp. 177-180, Oct. 2010.
- E. Song, J. Pak, and J. Kim, "TSV-based decoupling capacitor schemes in 3D-IC", IEEE 62nd Electronic Components and Technology Conference (ECTC), pp. 1340-1344, May 29 2012-Jun. 1 2012.