한국세라믹학회지 (Journal of the Korean Ceramic Society)

  • 제50권3호
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  • Pages.238-243
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  • 2013
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  • 1229-7801(pISSN)
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  • 2234-0491(eISSN)
한국세라믹학회 (The Korean Ceramic Society)
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Pb 금속필러가 첨가된 PbO-Bi2O3-B2O3-ZnO-SiO2계 유리의 특성

Characteristics of the PbO-Bi2O3-B2O3-ZnO-SiO2 Glass System Doped with Pb Metal Filler

  • 최진삼 (경상대학교 세라믹공학전공) ;
  • 정대용 (인하대학교 신소재공학부) ;
  • 신동우 (경상대학교 세라믹공학전공) ;
  • 배원태 (경상대학교 세라믹공학전공)
  • Choi, Jinsam (Department of Ceramic Engineering, Gyeongsang National University) ;
  • Jeong, DaeYong (School of Materials Engineering, Inha University) ;
  • Shin, Dong Woo (Department of Ceramic Engineering, Gyeongsang National University) ;
  • Bae, Won Tae (Department of Ceramic Engineering, Gyeongsang National University)
  • 투고 : 2013.02.22
  • 심사 : 2013.05.30
  • 발행 : 2013.05.31
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초록

We investigated the effect of Pb-metal filler added to a hybrid paste(PbO-$Bi_2O_3-B_2O_3$-ZnO glass frit and Pb-powder), for joining flip-chip sat lower temperatures than normal. The glass transition temperature was detected at $250^{\circ}C$ and the softening point occurred at $330^{\circ}C$. As the temperature increased, the specific density decreased due to the volatility of the Pb-metal and boron component in the glass. When the glass was heat-treated at $350^{\circ}C$ for 5 min, XRD results revealed a crystalline $Pb_4Bi_3B_7O_{19}$ phase that had been initiated by the addition of Pb-filler in the hybrid paste. The addition of the Pb-metal filler caused are action between the Pb-metal and glass that accelerated the formation of the liquid phase. The liquid phase that formed, promoted bonding between the flip-chip substrate sat lower temperature.

키워드

참고문헌

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피인용 문헌

  1. 중금속 창연산화납계 저온유리 분말을 이용한 세라믹스/금속의 접합거동 vol.51, pp.4, 2013, https://doi.org/10.4191/kcers.2014.51.4.312
  2. 습식분쇄에 의한 입자크기 변화에 따른 분쇄입자의 종횡비 거동 vol.30, pp.5, 2020, https://doi.org/10.3740/mrsk.2020.30.5.223
  3. 금속 필러가 첨가된 Pb-B-O계 유리와 Ni-Cr 합금 와이어 간의 전기 화학적 반응과 단락 거동 vol.31, pp.8, 2013, https://doi.org/10.3740/mrsk.2021.31.8.471