Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Solderability and BGA Joint Reliability of Sn-Ag-Cu-In-(Mn, Pd) Pb-free Solders

Sn-Ag-Cu-In-(Mn, Pd) 무연솔더의 솔더링성과 BGA 접합부 신뢰성

  • Jang, Jae-Won (Advanced Welding & Joining Technology Center, KITECH) ;
  • Yu, A-Mi (Advanced Welding & Joining Technology Center, KITECH) ;
  • Lee, Jong-Hyun (Department of Materials Science & Engineering, Seoul National University of Science & Technology) ;
  • Lee, Chang-Woo (Advanced Welding & Joining Technology Center, KITECH) ;
  • Kim, Jun-Ki (Advanced Welding & Joining Technology Center, KITECH)
  • 장재원 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터) ;
  • 유아미 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터) ;
  • 이종현 (서울과학기술대학교 신소재공학과) ;
  • 이창우 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터) ;
  • 김준기 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터)
  • Received : 2013.09.04
  • Accepted : 2013.09.27
  • Published : 2013.09.30
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Abstract

Although the lowering of Ag content in Sn-3.0Ag-0.5Cu is known to improve the mechanical shock reliability of the solder joint, it is also known to be detrimental to the solderbility. In this study, the quaternary alloying effect of In and the minor alloying effects of Mn and Pd on the solderability, thermal cycling and mechanical shock reliabilities of the low Ag content Sn-1.2Ag-0.7Cu solder were investigated using board-level BGA packages. The solderability of Sn-1.2Ag-0.7Cu-0.4In was proved to be comparable to that of Sn-3.0Ag-0.5Cu but its thermal cycling reliability was inferior to that of Sn-3.0Ag-0.5Cu. While the 0.03 wt% Pd addition to the Sn-1.2Ag-0.7Cu-0.4In decreased the solderability and reliabilities of solder joint, the 0.1 wt% Mn addition was proved to be beneficial especially for the mechanical shock reliability compared to those of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu compositions. It was considered to be due that the Mn addition decreased the Young's modulus of low Ag content Pb-free solders.

Sn-3.0Ag-0.5Cu 무연솔더에서 Ag 함량의 감소는 기계적 충격 신뢰성 향상에 도움이 되는 반면 솔더링성을 저하시키는 것으로 알려져 있다. 본 연구에서는 저 Ag함유 무연솔더의 솔더링성 향상을 위해 In을 첨가한 Sn-1.2Ag-0.7Cu-0.4In 4원계 조성과 여기에 미량의 Mn 및 Pd을 첨가한 무연솔더 조성에 대하여 솔더 젖음성을 평가하고, 보드 레벨 BGA 패키지의 열싸이클링 및 기계적 충격 신뢰성을 평가하였다. Sn-1.2Ag-0.7Cu 조성에 0.4 wt% In을 첨가한 합금의 젖음성은 Sn-3.0Ag-0.5Cu에 근접한 수준으로 향상되었으나, 패키지의 열싸이클링 신뢰성은 Sn-3.0Ag-0.5Cu에 미치지 못하는 것으로 나타났다. Sn-1.2Ag-0.7Cu-0.4In 조성에 0.03 wt% Pd의 첨가는 솔더 젖음성 및 패키지 신뢰성을 저하시킨 반면에 0.1 wt% Mn을 첨가한 합금은 특히 기계적 충격 신뢰성이 Sn-3.0Ag-0.5Cu는 물론 Sn-1.0Ag-0.5Cu보다도 우수한 수준으로 향상되었는데, 이는 Mn 첨가가 합금의 모듈러스를 감소시킨 데에 기인하는 것으로 생각된다.

Keywords

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