마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제20권3호
  • /
  • Pages.7-10
  • /
  • 2013
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  • 1226-9360(pISSN)
  • /
  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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비선형모델링을 통한 온습도 바이어스 시험 중의 다층 세라믹축전기 수명 예측

Failure Prediction of Multilayer Ceramic Capacitors (MLCCs) under Temperature-Humidity-Bias Testing Conditions Using Non-Linear Modeling

  • 권대일 (UNIST, 인간 및 시스템 공학과) ;
  • ;
  • Kwon, Daeil ;
  • Azarian, Michael H. (University of Maryland, Mechanical engineering) ;
  • Pecht, Michael (University of Maryland, Mechanical engineering)
  • 투고 : 2013.09.13
  • 심사 : 2013.09.25
  • 발행 : 2013.09.30
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초록

This study presents an approach to predict insulation resistance failure of multilayer ceramic capacitors (MLCCs) using non-linear modeling. A capacitance aging model created by non-linear modeling allowed for the prediction of insulation resistance failure. The MLCC data tested under temperature-humidity-bias testing conditions showed that a change in capacitance, when measured against a capacitance aging model, was able to provide a prediction of insulation resistance failure.

키워드

참고문헌

  1. H. Lee, "Embedded Passives", J. Microelectron. Packag. Soc., 9(2), 55 (2002).
  2. M. Keimasi, M. Azarian, and M. Pecht, "Flex Cracking of Multilayer Ceramic Capacitors Assembled with Lead-Free and Tin-Lead Solders", IEEE Trans. DeviceMater. Reliabili., 8(1), 182 (2008). https://doi.org/10.1109/TDMR.2007.912256
  3. J. Prymak and J. Berganthal, "Capacitance Monitoring While Flex Testing", IEEE Trans. Comp., Packag., Manufact. Technol., 18(1), 180 (1995). https://doi.org/10.1109/95.370753
  4. N. Kubodera, T. Oguni, M. Matsuda, H. Wada, N. Inoue and T. Nakamura "Study of the Long Term Reliability for MLCCs", Proc. CARTS International, Las Vegas, Electronic Components Industry Association (ECIA) (2012).
  5. K. Kim, S. Huh and J. Jang, "Failure Mechanism and Test Method for Reliability Standardization of Solder Joints", J. Microelectron. Packag. Soc., 18(4), 85 (2011).
  6. S. Jianzhong, S. Cheng and M. Pecht, "Prognostics of Multilayer Ceramic Capacitors via the Parameter Residuals", IEEE Trans. Device Mater. Reliabili., 12(1), 49 (2012). https://doi.org/10.1109/TDMR.2011.2162517

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