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The Influence of Additives on the Mechanical Properties of Electrodeposited Copper Foils

첨가제에 의한 구리 박막의 기계적 특성 변화

  • Woo, Tae-Gyu (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Park, Il-Song (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Jung, Kwang-Hee (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Son, Kyu-Song (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Song, Ram (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Lee, Man-Hyung (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Hwang, Young-Kyu (Calix Electronic chemical Co., Ltd.) ;
  • Seol, Kyeong-Won (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
  • 우태규 (전북대학교 공과대학 신소재공학부) ;
  • 박일송 (전북대학교 공과대학 신소재공학부) ;
  • 정광희 (전북대학교 공과대학 신소재공학부) ;
  • 손규송 (전북대학교 공과대학 신소재공학부) ;
  • 송람 (전북대학교 공과대학 신소재공학부) ;
  • 이만형 (전북대학교 공과대학 신소재공학부) ;
  • 황영규 (칼릭스전자화학(주)) ;
  • 설경원 (전북대학교 공과대학 신소재공학부)
  • Received : 2011.09.19
  • Published : 2012.03.25

Abstract

The objective of this study is to investigate the effect of additives on the mechanical and electrical characteristics of electrodeposited copper foils. Additives A(leveler) and B(brightener) were used in this study and Cl ions were used as an accelerator. In case of using these additives A and B, it showed a disadvantage that decreased the elongation of electrodeposited layer due to decreased grain sizes and increased tensile strength. On the other hand, the Cl ions decreased the specific resistance of the copper layer and increased elongation owing to increasing grain sizes. The highest elongation and lowest resistivity were measured in the group added only Cl ions, whose values were 21.9% and $3.11{\mu}\Omega$-cm, respectively.

Keywords

References

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