Abstract
To examine possibilities to make use of woodceramics for the lower material of hot-floored ondol boards, woodceramics made from sawdust board with Pinus densiflora, put them in a wood frame and concrete block and heated them sending an electric current, and measured changes in surface temperature of a laminated floor board and a plywood floor board. As the sending an electric current to time passed, their surface temperature increased rapidly up to 20 minutes, and then gradually ascended. In terms of the surface temperature in the wood frame, the beginning temperature of a plywood floor board was higher than that of laminated floor one; however, as time passed, a laminated floor board's temperature rose, and after 60 minutes, it showed similar to the temperature of a floor board of lamination. On the other hand, the surface temperature in a concrete block showed that the laminated floor board was higher than the plywood floor board in both early and 60-minute later temperatures. With the lapse of time after switching off, the surface temperature of floor boards slowly dwindled up to 9 minutes, and from that time on, began to drop sharply. In terms of the descent speed of surface temperature, when woodceramics' surface temperature was adjusted at $70^{\circ}C$, the laminated floor board was the highest; when it was at $80^{\circ}C$, the plywood floor board was the highest, resulting in rapid descent speed of heat.
소나무 톱밥보드로 제조된 우드세라믹에 전선을 연결하여 목재 틀과 콘크리트 블록 속에 넣고 통전하여 강화마루판과 합판마루판의 표면온도 상승과 하강변화를 조사 하여 우드세라믹을 온돌마루판 하부소재로 이용할수 있는 가능성을 검토하였다. 통전시간 60분 후 마루판의 표면온도와 처음 시작온도 차이는 강화마루판이 크게 나타나 합판마루판보다 열전달이 빠름을 알 수 있었다. 목재 틀에서 우드세라믹 표면설정온도가 $70^{\circ}C$와 $80^{\circ}C$일 때 60분 후 강화마루판의 표면온도는 각각 $37.8^{\circ}C$와 $39.4^{\circ}C$로 높게 나타나 열전달이 우수하였다. 각 우드세라믹 표면설정온도별 처음 시작온도와 30분후의 표면온도 하강차이는 목재 틀이 콘크리트 블록보다, 강화마루판이 합판마루판보다 커서 온도하강이 빠름을 알 수 있었다. 우드세라믹 자체의 표면온도 하강은 목재 틀보다 콘크리트 블럭에서 하강속도가 빨랐으며, 마루판의 하강속도가 우드세라믹의 하강속도보다 느려 마루판이 오랜 시간 열을 유지하고 있음을 알 수 있었다.
