마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제19권2호
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  • Pages.67-72
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  • 2012
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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전기도금법을 이용한 FCCL용 구리박막 제조시 레벨러의 영향 연구

The Effects of Levelers on Electroplating of Thin Copper Foil for FCCL

  • 강인석 (홍익대학교 신소재공학과) ;
  • 구연수 (광양보건대학 제철금속과) ;
  • 이재호 (홍익대학교 신소재공학과)
  • Kang, In-Seok (Dept. of Materials Science and Engineering, Hongik University) ;
  • Koo, Yeon-Soo (Dept. of Manufacture and Metallurgical Engineering, Gwangyang Health College) ;
  • Lee, Jae-Ho (Dept. of Materials Science and Engineering, Hongik University)
  • 투고 : 2012.06.13
  • 심사 : 2012.06.28
  • 발행 : 2012.06.30
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초록

최근에 전자 산업 분야에서 장치의 고용량을 구현 하기 위해 구동 drive IC의 선폭은 좁아지고 집적도는 증가하고 있다. 이러한 반도체, 전자 산업 분야의 초소형화, 고밀도화에 따라 FCCL(Flexible Copper Clad Laminate)의 표면 품질이 더욱 중요해 지고 있다. FCCL의 표면 결함으로는 돌기, 스크레치, 덴트 등이 있다. 특히 돌기가 표면에 존재할 경우 후속 공정에서 쇼트와 같은 불량을 유발할 수 있으며, 제품의 품질 저하를 야기 시킬 수 있다. 하지만 표면에 돌기가 존재한다 하더라도, 전해액의 레벨링 특성이 우수하다면 돌기의 성장을 막을 수 있다.평탄하고, 결함이 없는 도금표면을 얻기 위해서는 첨가제의 역할이 필수적이다. 평탄한 구리 표면을 형성하기 위해서 stock solution에 가속제, 억제제, 레벨러를 첨가하였다. 레벨러를 첨가하는 이유는 평탄한 표면을 얻고, 돌기의 형성을 억제하기 위함이다. 구리도금 표면 형상을 향상시키기 위한 레벨러로는 SO(Safranin O), MV(Methylene Violet), AB(Alcian Blue), JGB(Janus Green B), DB(Diazine Black) and PVP(Polyvinyl Pyrrolidone)가 사용되었다. 도금 첨가제와 도금 조건의 변화를 통해 도금시레벨링 특성을 향상시키고, 레벨링 특성 측정을 위해 니켈 인공돌기를 제작 한 후 레벨링 특성을 측정하였다.

In recent days, the wire width of IC is narrowed and the degree of integration of IC is increased to obtain the higher capacity of the devices in electronic industry. And then the surface quality of FCCL(Flexible Copper Clad Laminate) became increasingly important. Surface defects on FCCL are bump, scratch, dent and so on. In particular, bumps cause low reliability of the products. Even though there are bumps on the surface, if leveling characteristic of plating solution is good, it does not develop significant bump. In this study, the leveling characteristics of additives are investigated. The objective of study is to improve the leveling characteristic and reduce the surface step through additives and plating conditions. The additives in the electrodeposition bath are critical to obtain flat surface and free of defects. In order to form flat copper surface, accelerator, suppressor and leveler are added to the stock solution. The reason for the addition of leveler is planarization surface and inhibition of the formation of micro-bump. Levelers (SO(Safranin O), MV(Methylene Violet), AB(Alcian Blue), JGB(Janus Green B), DB(Diazine Black) and PVP(Polyvinyl Pyrrolidone) are used in copper plating solution to enhance the morphology of electroplated copper. In this study, the nucleation and growth behavior of copper with variation of additives are studied. The leveling characteristics are analyzed on artificially fabricated Ni bumps.

키워드

참고문헌

  1. S. H. Kim, S. H. Cho, N. E. Lee, H. M. Kim, Y. W. Nam and Y. H. Kim, "Adhesion properties of Cu/Cr films on polyimide substrate treated by dielectric barrier discharge plasma", Surf. Coat. Tech., 193, 101 (2005). https://doi.org/10.1016/j.surfcoat.2004.08.130
  2. S. S. Byun and J. H. Lee, "The Effects of Copper Electroplating Bath on Fabrication of Fine Copper Lines on Polyimide Film Using Semi-additive Method", J. Microelectron. Packag. Soc., 13(2), 9 (2006).
  3. M. H. Kim, H. R. Cha, C. S. Choi, H. S. Kim and D. Y. Lee, "Effects of Gelatin Additives on the Microstructures and Corrosion Properties of Electrodeposited Cu Thin Films", Kor. J. Met. Mater., 48(8), 757 (2010).
  4. M. H. Kim, H. R. Cha, C. S. Choi, H. S. Kim and D. Y. Lee, "The Influence of Gelatin Additives on the Mechanical Properties of Electrodeposited Cu Thin Films", Kor. J. Met. Mater., 48(10), 884 (2010). https://doi.org/10.3365/KJMM.2010.48.10.884
  5. K. Kondo, N. Yamakawa, Z. Tanaka and K. Hayashi, "Copper damascene electrodeposition and additives", J. Electroanal. Chem., 559, 137 (2003). https://doi.org/10.1016/S0022-0728(03)00110-4
  6. W. P. Dow, C. C. Li, M. W. Lin, G. W. Su and C. C. Huang, "Copper Fill of Microvia Using a Thiol-Modified Cu Seed Layerand Various Levelers", J. Electrochem. Soc., 156, 314 (2009). https://doi.org/10.1149/1.3147273
  7. S.E. Lee and J.H. Lee, "Copper Via Filling Using Organic Additives and Wave Current Electrolating", J. Microelectron. Packag. Soc., 14(3), 37 (2007).
  8. W. P. Dow, C. C. Li, Y. C. Sub, S. P. Shena, C. C. Huang, C. Lee, B. Hsu and S. Hsu, "Microvia filling by copper electroplating using diazine black as a leveler", Electrochim. Acta, 54, 5894 (2009). https://doi.org/10.1016/j.electacta.2009.05.053
  9. Y. Y. Lee, Y. J. Park, J. B. Lee and B. W. Cho, "Effects of Leveler on the Trench Filling during Damascene Copper Plating", J. Korean. Electrochem. Soc., 5(3), 153 (2002). https://doi.org/10.5229/JKES.2002.5.3.153

피인용 문헌

  1. Flexible Durability of Ultra-Thin FPCB vol.21, pp.4, 2014, https://doi.org/10.6117/kmeps.2014.21.4.069
  2. Changes in Electrical Properties of Copper-Plated Layer by Organic Additives on High Current Density vol.58, pp.1, 2020, https://doi.org/10.3365/kjmm.2020.58.1.41
  3. Effects of JGB Additives on the Microstructures and Electrical Properties of Electroplated Copper Foil vol.59, pp.6, 2012, https://doi.org/10.3365/kjmm.2021.59.6.404