Journal of Welding and Joining

  • 제30권3호
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  • Pages.32-37
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  • 2012
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
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LED 및 반도체 소자 리드프레임 패키징용 Cu/STS/Cu 클래드메탈의 기계적/열전도/전기적 특성연구

Study on the Mechanical Properties and Thermal Conductive Properties of Cu/STS/Cu Clad Metal for LED/semiconductor Package Device Lead Frame

  • 이창훈 (서울과학기술대학교 NID대학원) ;
  • 김기출 (목원대학교, 소재디자인공학과) ;
  • 김용성 (서울과학기술대학교 NID대학원)
  • Lee, Chang-Hun (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology) ;
  • Kim, Ki-Chul (Department of Material Design Engineering, Mokwon University) ;
  • Kim, Young-Sung (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology)
  • 발행 : 2012.06.30
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초록

Lead frame which has a high thermal conductivity and high mechanical strength is one of core technology for ultra-thin electronics such as LED lead frames, memory devices of semiconductors, smart phone, PDA, tablet PC, notebook PC etc. In this paper, we fabricated a Cu/STS/Cu 3-layered clad metal for lead frame packaging materials and characterized the mechanical properties and thermal conductive properties of the clad metal lead frame material. The clad metal lead frame material has a comparable thermal conductivity to typical copper alloy lead frame materials and has a reinforced mechanical tensile strength by 1.6 times to typical pure copper lead frame materials. The thermal conductivity and mechanical tensile strength of the Cu/STS/Cu clad metal are 284.35 W/m K and $52.78kg/mm^2$, respectively.

키워드

참고문헌

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피인용 문헌

  1. Thermal Stability of the Mechanical and Thermal Conductive Properties on Cu-STS-Cu Clad Metal for LED Package Lead Frame vol.31, pp.5, 2013, https://doi.org/10.5781/KWJS.2013.31.5.77