응집제와 관형막을 활용한 CMP 폐수 처리 가능성 연구

The Feasibility Study of CMP Wastewater Treatment Using Tubular Membrane and Coagulants

  • 정호찬 (웅진코웨이 환경기술연구소 환경기술연구팀) ;
  • 정철중 (웅진코웨이 환경기술연구소 환경기술연구팀) ;
  • 송자연 (웅진코웨이 환경기술연구소 환경기술연구팀) ;
  • 김연국 (웅진코웨이 환경기술연구소 환경기술연구팀) ;
  • 이선용 (웅진코웨이 환경기술연구소 환경기술연구팀)
  • Jung, Ho Chan (Woongjin Coway Co., Ltd. Institute of Environmental Technology, Environmental Technology Research Team) ;
  • Jung, Cheol Joong (Woongjin Coway Co., Ltd. Institute of Environmental Technology, Environmental Technology Research Team) ;
  • Song, Ja Yeon (Woongjin Coway Co., Ltd. Institute of Environmental Technology, Environmental Technology Research Team) ;
  • Kim, Youn Kook (Woongjin Coway Co., Ltd. Institute of Environmental Technology, Environmental Technology Research Team) ;
  • Lee, Sun Yong (Woongjin Coway Co., Ltd. Institute of Environmental Technology, Environmental Technology Research Team)
  • 발행 : 2012.09.30

초록

The purpose of this study is to identify the possibility of the CMP wastewater treatment from semiconductor fabrication under operating tubular membrane with coagulants. To find suitable coagulants treating CMP wastewater, we conducted Jar-test. After Jar-test experiments suitable coagulants are PAC(17%), $Ca(OH)_2$ and optimum coagulant dosage is PAC(17%) 10mg/L, $Ca(OH)_2$ 110 ~ 120mg/L. Based on these results, the tubular membrane was applied to CMP wastewater, the turbidity removal efficiency is $Ca(OH)_2$ > PAC(17%) > Nothing. The fast cross-flow velocity and backwash process what are operating characteristics of tubular membrane can be stable CMP wastewater treatment. But when the coagulant and tubular membrane are used at the same time, the withdraw and treatment of the CMP wastewater are possibile. However further treatment process needs if treated water will be used for semiconductor fabrications.

키워드

참고문헌

  1. 안명기, 김금용, 류홍덕, 이상일(2010). 유동상 반응기를 이용한 반도체 폐수의 불소처리, 대한환경공학회지, 32(5), pp. 437-442.
  2. 안명기, 김승하, 백주현, 김진형, 류홍덕, 이상일(2009). 반도체 폐수의 불화칼슘 결정화, 한국폐기물학회지, 26(5), pp. 456-466
  3. 안명기, 김진식, 김금용, 류홍덕, 이상일(2010). 유동상 반응기를 이용한 반도체 폐수 내 불소 처리시 $CaF_2$ 주입량, pH 및 처리수 재순환의 영향, 대한환경공학회지, 32(6), pp. 593-598.
  4. 안명기, 우귀남, 김진형, 강민구, 류홍덕, 이상일(2009). Struvite 결정화를 이용한 반도체 폐수처리 시 불소제거를 위한 최적조건, 수질보전 한국물환경학회지, 25(6), pp. 916-921.
  5. 지은상(1991). 산업폐수에 관형막 분리응용, 한국막학회 1991년도 추계 총회 및 학술발표회, 2, pp. 58-63.
  6. 홍성호, 오석환(2001). CMP폐액의 고액 분리를 위한 최적 응집조건에 관한 연구, 청정기술, 7(1), pp. 27-34.
  7. Corlett, G. (2000). Targeting water use for chemical mechanical polishing, Solid State Technology, 43(6), pp. 182-187.
  8. Corlett, G. L. and Roberson, G. A. (2000). Method and apparatus for recovery of water and slurry abrasives used for chemical and mechanical planarization, US Patent 6096185.
  9. Doble, M. and Kumar, A. (2005). Biotreatment of industrial effluents, Elsevier, pp. 157-168.
  10. Golden, J. H., Small, R., Pagan, L., Shang, C., and Ragavan, S. (2000). Evaluating and treating CMP wastewater, Semiconductor International, http://www.e-insite.net/semiconductor
  11. Kuan, W. H. and Hu, C. Y. (2009). Chemical evidences for the optimal coagulant dosage and pH adjustment of silica removal from chemical mechanical polishing (CMP) wastewater, Colloids and Surfaces A : Physicochmical and Engineering Aspects, 342, pp. 1-7. https://doi.org/10.1016/j.colsurfa.2009.03.019
  12. Lai, C. L. and Lin, S. H. (2003). Electrocoagulation of chemical mechanical polishing(CMP) wastewater from semiconductor fabrication, Chemical Engineering Journal, 95, pp. 205-211. https://doi.org/10.1016/S1385-8947(03)00106-2
  13. Ndiaye, P. I., Moulin, P., Dominguez, L., Millet, J. C., and Charbit, F. (2004). Treatment of silica effluents : ultrafiltration or coagulation-decantation, J. Hazard. Mater., B116, pp. 75-81. https://doi.org/10.1016/j.jhazmat.2004.07.006
  14. Steigerwald, J. M., Murarka, S. P., and Guttmann, R. J. (1997). Chemical Mechanical Planarization of Semiconductor Materials, Wiley, pp. 34-51.
  15. Testa, F., Coetsier, C., Carretier, E., Ennahali, M., Laborie, B., Serafino, C., Bulgarelli, F., and Moulin, P. (2011). Retreatment of silicon slurry by membrane process, J. Hazard. Mater., 192, pp. 440-450. https://doi.org/10.1016/j.jhazmat.2011.05.016
  16. Yang, C. C., Yang, T. Y., and Tsai, S. H. (2002). Crossflow electro-microfiltration of oxide-CMP wastewater, Water Research, 37, pp. 785-792.