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Thermoinitiated Cationic Polymerization of Epoxy Resin by Sulfonium Salts for Latent Curing

Sulfonium 염에 의한 Epoxy 수지의 잠재성 경화형 열 개시 양이온 중합반응

  • Kim, Sun Hee (Department of Chemistry, Chungbuk National University) ;
  • Shin, Min Jae (Department of Chemical and Biomolecular Engineering, KAIST) ;
  • Shin, Jae Sup (Department of Chemistry, Chungbuk National University)
  • Received : 2012.02.10
  • Accepted : 2012.06.04
  • Published : 2012.04.30

Abstract

A latent curing system was necessary for the anisotropic conducting film (ACF), and a fast reaction system was also necessary to fast production. In this study, the benzylsulfonium salts were synthesized and were used as latent curing initiators for epoxy resin. These benzylsulfonium compounds exhibited a long shelf life with epoxy resin. The curing behaviors of an epoxy resin with these sulfonium salts were investigated using differential scanning calorimetry (DSC), and the curing times were determined at $150^{\circ}C$ using an indentation method.

Anisotropic conducting film (ACF)을 형성하기 위해서는 경화과정에 잠재성이 있어야만 하며, 보다 빠른 생산성을 갖기 위해서는 반응속도가 매우 높아야 한다. 이 연구에서는 여러 가지의 sulfonium 염들을 합성해서 epoxy 수지의 잠재성 경화제로 사용해 보았다. 이들 sulfonium 염들은 모두 우수한 잠재성을 보여 주었다. Differential scanning calorimetry (DSC)를 이용해서 이들의 경화거동을 살펴보았으며, $150^{\circ}C$에서의 경화 속도를 탐침법으로 측정하였다.

Keywords

Acknowledgement

Supported by : Ministry of Knowledge Economy

References

  1. F. L. Jin and S. J. Park, J. Ind. Eng. Chem. 14, 564 (2008). https://doi.org/10.1016/j.jiec.2008.04.003
  2. S. J. Park and F. L. Jin, J. Ind. Eng. Chem. 11, 726 (2005).
  3. J. Y. Lee, Y. W. Song, and M. J. Shim, J. Ind. Eng. Chem., 10, 601 (2004).
  4. Y. S. Cho, H. K. Lee, M. J. Shim, and S. W. Kim, J. Ind. Eng. Chem., 3, 171 (1997).
  5. Y. R. Ham, S. H. Kim, Y. J. Shin, D. H. Lee, M. Yang, J. H. Min, and J. S. Shin, J. Ind. Eng. Chem., 16, 556 (2010). https://doi.org/10.1016/j.jiec.2010.03.022
  6. Y. R. Ham, D. H. Lee, S. H. Kim, Y. J. Shin, M. Yang, and J. S. Shin, J. Ind. Eng. Chem., 16, 728 (2010). https://doi.org/10.1016/j.jiec.2010.07.011
  7. M. J. Yim and K. W. Paik, Int. J. Adhes. Adhes., 26, 304 (2006). https://doi.org/10.1016/j.ijadhadh.2005.04.004
  8. K. W. Jang and K. W. Paik, IEEE Trans. Electron. Packag. Manuf., 32, 74 (2009). https://doi.org/10.1109/TEPM.2009.2015288
  9. A. Kikkawa, T. Takata, and T. Endo, Makromol. Chem., 192, 655 (1991). https://doi.org/10.1002/macp.1991.021920316
  10. K. Morio, H. Murase, H. Tsuchiya, and T. Endo, J. Appl. Polym. Sci., 32, 5727 (1986). https://doi.org/10.1002/app.1986.070320705
  11. J. A. Mcgowen and L. J. Mathias, Polym. Compos., 19, 348 (1997).
  12. F. Hamazu, S. Akashi, T. Koizumi, T. Takata, and T. Endo, J. Polym. Sci., Polym. Chem. Ed., 31, 1023 (1993). https://doi.org/10.1002/pola.1993.080310424
  13. F. Hamazu, S. Akashi, T. Koizumi, T. Takata, and T. Endo, J. Polym. Sci., Polym. Chem. Ed., 29, 1675 (1991). https://doi.org/10.1002/pola.1991.080291119
  14. T. Endo and H. Uno, J. Polym. Sci., Polym. Lett. Ed., 23, 359 (1985). https://doi.org/10.1002/pol.1985.130230703