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유한요소법을 이용한 LED 칩의 접합부 온도 해석

Analysis of the Junction Temperature in the LED Chips using the Finite Element Method

  • 투고 : 2012.09.17
  • 심사 : 2012.12.05
  • 발행 : 2012.12.31

초록

It is difficult to determine the junction temperature because LED lightings are manufactured using several chips with low power. This paper reports on the finite element method of the determination of junction temperature in the GaN-based LEDs. The calculated junction temperature of the LED chip using FEM was compared with the experimentally measured data. As the results of this study, the junction temperature of LED chips with via holes is lower than that of LED chips without via hole. Therefore, the research of via hole is necessary to decrease junction temperature of LED chips.

키워드

과제정보

연구 과제 주관 기관 : 호서대학교

참고문헌

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