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Chip Bonding Machine Base 구조해석에 관한 연구

Study on the Structural Analysis of Chip Bonding Machine Base

  • 김원종 (금오공과대학교 대학원 기계설계공학과) ;
  • 황은하 (금오공과대학교 기계설계공학과, 한국과학기술원)
  • Kim, Won-Jong (Department of Engineering Science & Mechanics, Graduate School, KIT) ;
  • Hwang, Eun-Ha (Department of Mechanical Design Engineering, KIT, KAIST)
  • 투고 : 2012.04.12
  • 심사 : 2012.05.25
  • 발행 : 2012.05.31

초록

This study is concerned about the design and structural analysis of high integrated Chip Bonding Machine. Recently, many studies have been undergoing to reduce a working time in a field of Chip Bonding Machine. Chip Bonding Machine belongs to reduce a stand-by time by Chip Moving time. The developed system can save tool moving distance in small space than other machine. The analysis is carried out by SoldEdge & Ansys software.

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