한국산업융합학회 논문집 (Journal of the Korean Society of Industry Convergence)

  • 제15권2호
  • /
  • Pages.55-58
  • /
  • 2012
  • /
  • 1226-833X(pISSN)
  • /
  • 2765-5415(eISSN)
한국산업융합학회 (The Korean Society of Industry Convergence)
권호 표지
DOI QR코드

DOI QR Code

Chip Bonding Machine Base 구조해석에 관한 연구

Study on the Structural Analysis of Chip Bonding Machine Base

  • 김원종 (금오공과대학교 대학원 기계설계공학과) ;
  • 황은하 (금오공과대학교 기계설계공학과, 한국과학기술원)
  • Kim, Won-Jong (Department of Engineering Science & Mechanics, Graduate School, KIT) ;
  • Hwang, Eun-Ha (Department of Mechanical Design Engineering, KIT, KAIST)
  • 투고 : 2012.04.12
  • 심사 : 2012.05.25
  • 발행 : 2012.05.31
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

This study is concerned about the design and structural analysis of high integrated Chip Bonding Machine. Recently, many studies have been undergoing to reduce a working time in a field of Chip Bonding Machine. Chip Bonding Machine belongs to reduce a stand-by time by Chip Moving time. The developed system can save tool moving distance in small space than other machine. The analysis is carried out by SoldEdge & Ansys software.

키워드